{"id":63216,"date":"2020-06-18T06:35:41","date_gmt":"2020-06-18T06:35:41","guid":{"rendered":"https:\/\/www.xyztec.com\/docs\/copper-pillar-pull\/"},"modified":"2023-12-21T13:31:58","modified_gmt":"2023-12-21T13:31:58","slug":"copper-pillar-pull","status":"publish","type":"docs","link":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/","title":{"rendered":"Copper pillar pull"},"content":{"rendered":"<h2>Copper pillar pull<\/h2>\n<p>Copper pillar is rapidly being adopted as a bumped wafer interconnect. The construction is that of a Copper cylinder around 50\u00b5m in diameter and height, topped with a dome of solder.<\/p>\n<p>As with any interconnect the quality of the bonding process between the different parts is vital for the reliability of the finished product. The bond between the copper and its pad on the wafer are of particular interest as this is seen as the most likely failure mode. In a bond test a failure mode between the copper and wafer is then the \u201cfailure mode of interest\u201d.<\/p>\n<p><img decoding=\"async\" class=\"alignnone size-full wp-image-16105\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_1.png\" alt=\"Copper Pillar\" width=\"203\" height=\"124\" \/><img decoding=\"async\" class=\"alignnone size-full wp-image-16077\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_friction_grip.png\" alt=\"Friction grip\" width=\"126\" height=\"126\" \/> <img decoding=\"async\" class=\"alignnone size-full wp-image-16070\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Reformed_solder_ball.png\" alt=\"Reformed_solder_ball\" width=\"142\" height=\"126\" \/><\/p>\n<p><!--more--><\/p>\n<h2>Test features<\/h2>\n<ul class=\"bulletimg\">\n<li>Sensor accuracy \u00b10.075%<\/li>\n<li>Down to 35\u00b5m diameter copper pillars<\/li>\n<\/ul>\n<h2>Copper to pad interconnect<\/h2>\n<h3>Pull testing<\/h3>\n<p>This failure mode can be produced by either a pull or a shear test and the measured bond strength used for your process control. In many other applications pull testing is typically preferred because the bond is subjected to a simple tensile load, distributed over the bond area. The bond separation is clean making failure mode analysis of the surfaces relatively easy. Unlike solder bumps, Copper is relatively hard and gripping it therefore easier.<\/p>\n<p>Solder balls require precise reforming in order to be able to apply a meaningful test load on to the bond. Copper also has to be reformed in order to be able to grip it but this takes the form of well know gripping methods such as plain surfaces and friction, a few serrations that slightly reform the copper in order to get a mechanical grip or a slight tapper.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-16056\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_failure_mode_P1-1.png\" alt=\"Copper_Pillar_failure_mode_P1\" width=\"147\" height=\"261\" \/> <img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-medium wp-image-16049\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_pulltest_XYZTEC_Condor_Sigma-1-262x300.png\" alt=\"Copper_Pillar_pulltest_XYZTEC_Condor_Sigma\" width=\"262\" height=\"300\" \/><\/p>\n<h2>Solder to copper interconnect<\/h2>\n<h3>Cold bump pull testing<\/h3>\n<p>If you are interested in the interconnect between the solder and the copper, it depends on the shape of the construction whether a Cold Bump Pull (CBP) type test is feasible. If not, a shear may be the only effective test to qualify your process.\u00a0More on\u00a0<a href=\"https:\/\/www.xyztec.com\/how-to-cold-bump-pull-cbp\/\">CBP<\/a>\u00a0can be found in our\u00a0<a class=\"zwart\" href=\"https:\/\/www.xyztec.com\/test-types-2\/demo-page\/careers\/\">how-to test bonds<\/a>.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-16014\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/copper-pillar-can-be-tested-1.png\" alt=\"copper-pillar-can-be-tested\" width=\"157\" height=\"148\" \/> <img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-16007\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/copper-pillar-difficult-to-test-1.png\" alt=\"copper-pillar-difficult-to-test\" width=\"157\" height=\"149\" \/><\/p>\n<p>The test sequence for the CBP-approach is as follows<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-16098\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper-pillar-test-sequence-for-solder-interconnect-1.png\" alt=\"Copper-pillar-test-sequence-for-solder-interconnect\" width=\"618\" height=\"182\" \/><\/p>\n<h2>Choose between pull and shear testing<\/h2>\n<p>The choice between pull or shear testing depends on the application and the test objectives. Xyztec has a lot of experience with different types of copper pillar products and can advise you on how to test in order to get the best information for your quality assurance process. If you are interested to find out more please <a href=\"https:\/\/www.xyztec.com\/zh-hans\/%e4%b8%9a%e5%8a%a1%e7%aa%97%e5%8f%a3%e5%8f%8a%e7%9b%b8%e5%85%b3\/%e8%81%94%e7%b3%bb%e7%aa%97%e5%8f%a3\/\">contact us<\/a>\u00a0for more information, to request an application report, a demonstration or a quotation.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Copper pillar pull Copper pill [&hellip;]<\/p>\n","protected":false},"author":18,"featured_media":57666,"parent":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-63216","docs","type-docs","status-publish","has-post-thumbnail","hentry","doc_tag-copper-pillar-zh-hans-2","doc_tag-pull-zh-hans-2","doc_tag-shear-zh-hans-2","doc_category-pull-tests-zh-hans"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Copper pillar is rapidly being adopted as a bumped wafer interconnect<\/title>\n<meta name=\"description\" content=\"The construction is that of a Copper cylinder around 50\u00b5m in diameter and height, topped with a dome of solder.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/\" \/>\n<meta property=\"og:locale\" content=\"zh_CN\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Copper pillar is rapidly being adopted as a bumped wafer interconnect\" \/>\n<meta property=\"og:description\" content=\"The construction is that of a Copper cylinder around 50\u00b5m in diameter and height, topped with a dome of solder.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/\" \/>\n<meta property=\"og:site_name\" content=\"Xyztec\" \/>\n<meta property=\"article:modified_time\" content=\"2023-12-21T13:31:58+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_1.png\" \/>\n\t<meta property=\"og:image:width\" content=\"203\" \/>\n\t<meta property=\"og:image:height\" content=\"124\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"\u9884\u8ba1\u9605\u8bfb\u65f6\u95f4\" \/>\n\t<meta name=\"twitter:data1\" content=\"4 \u5206\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/knowledgecenter\\\/pull-tests-zh-hans\\\/copper-pillar-pull\\\/\",\"url\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/knowledgecenter\\\/pull-tests-zh-hans\\\/copper-pillar-pull\\\/\",\"name\":\"Copper pillar is rapidly being adopted as a bumped wafer interconnect\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/knowledgecenter\\\/pull-tests-zh-hans\\\/copper-pillar-pull\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/knowledgecenter\\\/pull-tests-zh-hans\\\/copper-pillar-pull\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.xyztec.com\\\/wp-content\\\/uploads\\\/2023\\\/06\\\/Copper_Pillar_1.png\",\"datePublished\":\"2020-06-18T06:35:41+00:00\",\"dateModified\":\"2023-12-21T13:31:58+00:00\",\"description\":\"The construction is that of a Copper cylinder around 50\u00b5m in diameter and height, topped with a dome of solder.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/knowledgecenter\\\/pull-tests-zh-hans\\\/copper-pillar-pull\\\/#breadcrumb\"},\"inLanguage\":\"zh-Hans\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/knowledgecenter\\\/pull-tests-zh-hans\\\/copper-pillar-pull\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"zh-Hans\",\"@id\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/knowledgecenter\\\/pull-tests-zh-hans\\\/copper-pillar-pull\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.xyztec.com\\\/wp-content\\\/uploads\\\/2023\\\/06\\\/Copper_Pillar_1.png\",\"contentUrl\":\"https:\\\/\\\/www.xyztec.com\\\/wp-content\\\/uploads\\\/2023\\\/06\\\/Copper_Pillar_1.png\",\"width\":203,\"height\":124,\"caption\":\"Copper Pillar 1\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/knowledgecenter\\\/pull-tests-zh-hans\\\/copper-pillar-pull\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"BetterDocs\",\"item\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/knowledgecenter\\\/%doc_category%\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Copper pillar pull\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/#website\",\"url\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/\",\"name\":\"Xyztec\",\"description\":\"\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.xyztec.com\\\/zh-hans\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"zh-Hans\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Copper pillar is rapidly being adopted as a bumped wafer interconnect","description":"The construction is that of a Copper cylinder around 50\u00b5m in diameter and height, topped with a dome of solder.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/","og_locale":"zh_CN","og_type":"article","og_title":"Copper pillar is rapidly being adopted as a bumped wafer interconnect","og_description":"The construction is that of a Copper cylinder around 50\u00b5m in diameter and height, topped with a dome of solder.","og_url":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/","og_site_name":"Xyztec","article_modified_time":"2023-12-21T13:31:58+00:00","og_image":[{"width":203,"height":124,"url":"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_1.png","type":"image\/png"}],"twitter_card":"summary_large_image","twitter_misc":{"\u9884\u8ba1\u9605\u8bfb\u65f6\u95f4":"4 \u5206"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/","url":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/","name":"Copper pillar is rapidly being adopted as a bumped wafer interconnect","isPartOf":{"@id":"https:\/\/www.xyztec.com\/zh-hans\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/#primaryimage"},"image":{"@id":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/#primaryimage"},"thumbnailUrl":"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_1.png","datePublished":"2020-06-18T06:35:41+00:00","dateModified":"2023-12-21T13:31:58+00:00","description":"The construction is that of a Copper cylinder around 50\u00b5m in diameter and height, topped with a dome of solder.","breadcrumb":{"@id":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/#breadcrumb"},"inLanguage":"zh-Hans","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/"]}]},{"@type":"ImageObject","inLanguage":"zh-Hans","@id":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/#primaryimage","url":"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_1.png","contentUrl":"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Copper_Pillar_1.png","width":203,"height":124,"caption":"Copper Pillar 1"},{"@type":"BreadcrumbList","@id":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/copper-pillar-pull\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.xyztec.com\/zh-hans\/"},{"@type":"ListItem","position":2,"name":"BetterDocs","item":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/%doc_category%\/"},{"@type":"ListItem","position":3,"name":"Copper pillar pull"}]},{"@type":"WebSite","@id":"https:\/\/www.xyztec.com\/zh-hans\/#website","url":"https:\/\/www.xyztec.com\/zh-hans\/","name":"Xyztec","description":"","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.xyztec.com\/zh-hans\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"zh-Hans"}]}},"_links":{"self":[{"href":"https:\/\/www.xyztec.com\/zh-hans\/wp-json\/wp\/v2\/docs\/63216","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.xyztec.com\/zh-hans\/wp-json\/wp\/v2\/docs"}],"about":[{"href":"https:\/\/www.xyztec.com\/zh-hans\/wp-json\/wp\/v2\/types\/docs"}],"author":[{"embeddable":true,"href":"https:\/\/www.xyztec.com\/zh-hans\/wp-json\/wp\/v2\/users\/18"}],"replies":[{"embeddable":true,"href":"https:\/\/www.xyztec.com\/zh-hans\/wp-json\/wp\/v2\/comments?post=63216"}],"version-history":[{"count":1,"href":"https:\/\/www.xyztec.com\/zh-hans\/wp-json\/wp\/v2\/docs\/63216\/revisions"}],"predecessor-version":[{"id":66359,"href":"https:\/\/www.xyztec.com\/zh-hans\/wp-json\/wp\/v2\/docs\/63216\/revisions\/66359"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.xyztec.com\/zh-hans\/wp-json\/wp\/v2\/media\/57666"}],"wp:attachment":[{"href":"https:\/\/www.xyztec.com\/zh-hans\/wp-json\/wp\/v2\/media?parent=63216"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}