{"id":64684,"date":"2020-06-18T06:36:17","date_gmt":"2020-06-18T06:36:17","guid":{"rendered":"https:\/\/www.xyztec.com\/docs\/stud-die-pull\/"},"modified":"2023-09-26T12:40:19","modified_gmt":"2023-09-26T12:40:19","slug":"stud-die-pull","status":"publish","type":"docs","link":"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/stud-die-pull\/","title":{"rendered":"Stud (die) pull"},"content":{"rendered":"<h2>Stud pull<\/h2>\n<p>The stud pull test is based on the principle that an adhesive connection is made with the carrier (or object to be tested) by using a glue that is stronger than the bond that needs to be tested.<\/p>\n<p><img fetchpriority=\"high\" decoding=\"async\" class=\"alignnone size-full wp-image-16563\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Stud-Pull.png\" alt=\"Stud-Pull\" width=\"392\" height=\"311\" \/><\/p>\n<p><!--more--><\/p>\n<h2>How to: Stud pull<\/h2>\n<div style=\"width: 640px;\" class=\"wp-video\"><video class=\"wp-video-shortcode\" id=\"video-64684-1\" width=\"640\" height=\"360\" preload=\"metadata\" controls=\"controls\"><source type=\"video\/mp4\" src=\"https:\/\/xyztecvideos.b-cdn.net\/Stud%20pull%20test.mp4?_=1\" \/><a href=\"https:\/\/xyztecvideos.b-cdn.net\/Stud%20pull%20test.mp4\">https:\/\/xyztecvideos.b-cdn.net\/Stud%20pull%20test.mp4<\/a><\/video><\/div>\n<h2>Standards<\/h2>\n<ul class=\"bulletimg\">\n<li><a href=\"https:\/\/www.xyztec.com\/knowledge-center\/mil-std-883-method-2011-9-bond-strength-destructive-bond-pull-test\/\">MIL-STD-883 method 2011.9 bond strength (destructive bond pull test)<\/a><\/li>\n<li><a href=\"https:\/\/www.xyztec.com\/knowledge-center\/mil-std-883-method-2031-1-flip-chip-pull-off-test\/\">MIL-STD-883 method 2031-1 flip-chip pull off test<\/a><\/li>\n<li>JEDEC JESD22-B109<\/li>\n<\/ul>\n<h2>Test features<\/h2>\n<ul class=\"bulletimg\">\n<li>High strength adhesive experience for the most challenging die pull applications<\/li>\n<li>Self aligning studs to prevent die peel<\/li>\n<li>Sensor accuracy \u00b10.075%<\/li>\n<li>Test at elevated temperatures up to 500\u00b0C<\/li>\n<\/ul>\n<h2>Highly reproducible stud pull tests are possible<\/h2>\n<p>The <a href=\"https:\/\/www.xyztec.com\/highly-reproducible-stud-pull-tests-are-possible\/\">Sigma\u00a0can be provided with a micro dispenser<\/a>\u00a0that can dispense very small drops of glue (micro liter amounts) very accurately and is cured with UV light. Combined with a\u00a0<a href=\"https:\/\/www.xyztec.com\/zh-hans\/%e7%89%b9%e8%89%b2\/%e5%b7%a5%e5%85%b7-%e5%a4%b9%e7%88%aa\/\">USB Tweezer<\/a> and special tips that look like the inverse of a mushroom, a glass stud can be taken from a magazine fully automatically and placed with a predefined pressure on the surface with the glue.<\/p>\n<h2>Alternative test for thin die attach<\/h2>\n<p>The stud pull test is used to test exotic applications such as bonded dies or pins pressed in FR4 boards. For die attach, the sample is clamped in a work holder and a stud is glued on the part to be tested. The stud is then pulled by a tweezer or other specially designed tooling. Depending on the stud pull application, xyztec can offer solutions from a few grams up to 500kgf. We also offer a manual tweezer that can test up to 40kgf and an optional camera system is available to record and analyze failure mode.<\/p>\n<p><img decoding=\"async\" class=\"alignnone size-full wp-image-16556\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/Keypad-stud-pull-test-setup.png\" alt=\"Keypad-stud-pull--test-setup\" width=\"150\" height=\"98\" \/><\/p>\n<h2>See also: lid pull test by mechanical grip method<\/h2>\n<p>As an alternative to stud pull, xyztec developed the <a href=\"https:\/\/www.xyztec.com\/zh-hans\/knowledgecenter\/pull-tests-zh-hans\/lid-pull\/lid-pull-2\/\">lid pull test by mechanical grip method<\/a>. This approach eliminates the need for disposable metal block\/studs and adhesives. Thus it is quicker, safer for operators and avoids clean room contamination.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Stud pull The stud pull test i [&hellip;]<\/p>\n","protected":false},"author":18,"featured_media":57731,"parent":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-64684","docs","type-docs","status-publish","has-post-thumbnail","hentry","doc_tag-pull-zh-hans-2","doc_tag-stud-die-pull-zh-hans-2","doc_category-pull-tests-zh-hans"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>How to: Stud pull test<\/title>\n<meta name=\"description\" content=\"A stud pull test is based on the principle that an adhesive connection made with the carrier by using a glue that is stronger than the bond\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, 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