BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Xyztec - ECPv6.18.2//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:Xyztec
X-ORIGINAL-URL:https://www.xyztec.com/zh-hans/
X-WR-CALDESC:Xyztec的活动
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:UTC
BEGIN:STANDARD
TZOFFSETFROM:+0000
TZOFFSETTO:+0000
TZNAME:UTC
DTSTART:20250101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=UTC:20260902T080000
DTEND;TZID=UTC:20260904T170000
DTSTAMP:20260730T095705Z
CREATED:20260730T085541Z
LAST-MODIFIED:20260730T095705Z
UID:75450-1788336000-1788541200@www.xyztec.com
SUMMARY:2026台湾半导体展（SEMICON Taiwan 2026）
DESCRIPTION:2026台湾半导体展（SEMICON Taiwan 2026）将于9月初于台北南港展览馆登场，持续凸显其作为全球半导体产业重要交流平台的地位.\n展会汇聚晶圆制造、设备、材料、先进封装与智慧制造等关键环节，已成为观察全球半导体供应链布局、技术升级与产业合作的重要指标.\n  \n今年展会主要聚焦智慧制造与先进封装，并首度设立晶圆智造特区，展现自动化、机器人、数位分身与工业AI等前沿应用，反映产业朝高效率、高整合与高精度方向持续演进.\n  \nxyztec长期深耕晶圆级与封装测试应用，主要客群涵盖半导体封装、晶圆级封装、Chiplet及高精度bond testing顶级客户；在台湾自动化测试领域，xyztec凭借自动化Bond Tester与整合能力，已建立稳定市场口碑.\n  \nxyztec将于本次展会中公开展示最新设备Sigma Nano.\n该机种主打更高的定位精度、更精准稳定的剪切高度控制与真正对应微米封装测试能力，锁定先进封装与高密度互连应用市场，此为本次展会现场焦点之一.\n  \n欢迎莅临南港展览馆1馆一楼K2176展位及四楼N0868展位参观指导。
URL:https://www.xyztec.com/zh-hans/event/2026%e5%8f%b0%e6%b9%be%e5%8d%8a%e5%af%bc%e4%bd%93%e5%b1%95%ef%bc%88semicon-taiwan-2026%ef%bc%89/
LOCATION:Taipei Nangang Exibithion Center\, No.1\, Jingmao 2nd Rd.\, Nangang District\, Taipei City 11568\, Taiwan\, Taipei City\, Taiwan
ATTACH;FMTTYPE=image/jpeg:https://www.xyztec.com/wp-content/uploads/2025/12/89658_0.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260909T080000
DTEND;TZID=UTC:20260911T170000
DTSTAMP:20260903T123923Z
CREATED:20251221T060747Z
LAST-MODIFIED:20260903T123923Z
UID:74207-1788940800-1789146000@www.xyztec.com
SUMMARY:CIOE
DESCRIPTION:xyztec at CIOE 2026 – Precision Bond Testing Leading the Optoelectronics Era \n  \nAt the 27th China International Optoelectronic Exposition (CIOE 2026)\, xyztec will showcase the latest capabilities of its bond testing equipment\, underscoring the company’s active participation in this premier global optoelectronics industry event. \n  \nWith CIOE 2026 highlighting the convergence of artificial intelligence and optoelectronics\, xyztec’s versatile bond testing systems deliver unmatched accuracy and reliability for advanced packaging\, chiplet integration\, and heterogeneous assembly. Combined with the highest level of automation\, these solutions ensure product integrity in applications ranging from high-speed optical communications to AI computing infrastructure. \n  \nxyztec warmly invites you to visit Booth 7A96 at the Shenzhen World Exhibition & Convention Center during CIOE 2026 to experience the power of precision bond testing firsthand.
URL:https://www.xyztec.com/zh-hans/event/cioe/
LOCATION:Shenzhen World Exhibition & Convention Center\, China
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260928T080000
DTEND;TZID=UTC:20261001T170000
DTSTAMP:20260916T072124Z
CREATED:20251212T172811Z
LAST-MODIFIED:20260916T072124Z
UID:74170-1790582400-1790874000@www.xyztec.com
SUMMARY:IMAPS Symposium
DESCRIPTION:As in the past 10 years\, xyztec will once again be a silver sponsor of this year’s IMAPS Symposium which brings together the microelectronics and advanced packaging community in Boston\, MA\, to discuss the technologies shaping the next generation of semiconductor packaging. This year’s program focuses on heterogeneous integration and photonics\, with topics including advanced interconnects\, bonding technologies\, wafer-level and fan-out packaging\, reliability\, manufacturing processes\, and metrology.\n\nThe technical developments presented at IMAPS place a strong focus on understanding and verifying the performance of semiconductor packages and their interconnections. Accurate mechanical testing provides valuable insight into bond strength and failure modes\, supporting process development\, quality control\, and reliability testing.\n\nWith more than 25 years dedicated to bond testing\, xyztec brings extensive application knowledge to semiconductor and advanced packaging. This experience helps engineers find reliable and repeatable test approaches for a wide range of packaging technologies and bond types.\n\nYou are welcome to visit xyztec at booth 327 and see the machine’s capabilities live!
URL:https://www.xyztec.com/zh-hans/event/imaps-symposium/
END:VEVENT
END:VCALENDAR