BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Xyztec - ECPv6.18.0//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-ORIGINAL-URL:https://www.xyztec.com/zh-hant/
X-WR-CALDESC:Events for Xyztec
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:UTC
BEGIN:STANDARD
TZOFFSETFROM:+0000
TZOFFSETTO:+0000
TZNAME:UTC
DTSTART:20250101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VTIMEZONE
TZID:Europe/Helsinki
BEGIN:DAYLIGHT
TZOFFSETFROM:+0200
TZOFFSETTO:+0300
TZNAME:EEST
DTSTART:20250330T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0300
TZOFFSETTO:+0200
TZNAME:EET
DTSTART:20251026T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0200
TZOFFSETTO:+0300
TZNAME:EEST
DTSTART:20260329T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0300
TZOFFSETTO:+0200
TZNAME:EET
DTSTART:20261025T010000
END:STANDARD
BEGIN:DAYLIGHT
TZOFFSETFROM:+0200
TZOFFSETTO:+0300
TZNAME:EEST
DTSTART:20270328T010000
END:DAYLIGHT
BEGIN:STANDARD
TZOFFSETFROM:+0300
TZOFFSETTO:+0200
TZNAME:EET
DTSTART:20271031T010000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;TZID=UTC:20260826T080000
DTEND;TZID=UTC:20260828T170000
DTSTAMP:20260730T095319Z
CREATED:20260730T093131Z
LAST-MODIFIED:20260730T095319Z
UID:75460-1787731200-1787936400@www.xyztec.com
SUMMARY:PCIM Asia
DESCRIPTION:PCIM Asia Shenzhen 2026作為深耕亞洲二十餘載的電力電子、智慧運動及可再生能源管理年度盛會，是連接產業鏈與前沿科研成果的覈心紐帶。\n本屆展會重點覆蓋SiC/GaN寬禁帶電晶體、功率電晶體元件及模塊、汽車電子/新能源汽車以及電氣化交通產業鏈等高價值應用領域。\n  \n在功率電晶體與車規級器件封裝測試領域，xyztec憑其強悍的大推力/大拉力測試技術、超高的重現性精度以及極致的自動化集成能力，始終保持著全球與中國市場的領導地位，為功率模組的封裝可靠性樹立了行業標杆。\n  \n在 2026 年深圳 PCIM Asia 展會現場，xyztec 將與其在中國的重要代理商 ExTripod 合作，公開展示其旗艦級全自動推拉力測試設備。\n現場將進行動態演示，展示針對功率模組的高效自動化推拉力測試解決方案，內容涵蓋粗鋁線／銅帶拉伸測試，以及高載荷模具剪切測試。 此次示範將重點展示這些解決方案如何有效應對高功率元件製造過程中所面臨的品質控制挑戰。\n  \n歡迎蒞臨展位參觀指導。
URL:https://www.xyztec.com/zh-hant/event/pcim-asia/
LOCATION:Shenzhen World Exhibition & Convention Center (Bao’an Venue)\, China\, Hall 16\, Shenzhen\, China
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260902T080000
DTEND;TZID=UTC:20260904T170000
DTSTAMP:20260730T095716Z
CREATED:20260730T091126Z
LAST-MODIFIED:20260730T095716Z
UID:75451-1788336000-1788541200@www.xyztec.com
SUMMARY:2026臺灣電晶體展 (SEMICON Taiwan 2026)
DESCRIPTION:2026臺灣電晶體展（SEMICON Taiwan 2026）將於9月初於臺北南港展覽館登場，持續凸顯其作為全球半導體產業重要交流平臺的地位。\n展會彙聚晶圓製造、設備、資料、先進封裝與智慧製造等關鍵環節，已成為觀察全球半導體供應鏈佈局、科技陞級與產業合作的重要名額。\n  \n今年展會主要聚焦智慧製造與先進封裝，並首度設立晶圓智造特區，展現自動化、機器人、數位分身與工業AI等前沿應用，反映產業朝高效率、高綜合與高精度方向持續演進。\n  \nxyztec長期深耕晶圓級與封裝測試應用，主要客群涵蓋電晶體封裝、晶圓級封裝、Chiplet及高精度bond testing頂級客戶； 在臺灣自動化測試領域，xyztec憑藉自動化Bond Tester與綜合能力，已建立穩定市場口碑。\n  \nxyztec將於本次展會中公開展示最新設備Sigma Nano。\n該機種主打更高的定位精度、更精准穩定的剪切高度控制與真正對應微米封裝測試能力，鎖定先進封裝與高密度互連應用市場，此為本次展會現場焦點之一。\n  \n歡迎蒞臨南港展覽館1館1樓 K2176 展位及4樓 N0868 展位參觀指導。
URL:https://www.xyztec.com/zh-hant/event/2026%e8%87%ba%e7%81%a3%e9%9b%bb%e6%99%b6%e9%ab%94%e5%b1%95-semicon-taiwan-2026/
LOCATION:Taipei Nangang Exibithion Center\, No.1\, Jingmao 2nd Rd.\, Nangang District\, Taipei City 11568\, Taiwan\, Taipei City\, Taiwan
ATTACH;FMTTYPE=image/jpeg:https://www.xyztec.com/wp-content/uploads/2025/12/89658_0.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260909T080000
DTEND;TZID=UTC:20260911T170000
DTSTAMP:20260903T123923Z
CREATED:20251221T060747Z
LAST-MODIFIED:20260903T123923Z
UID:74207-1788940800-1789146000@www.xyztec.com
SUMMARY:CIOE
DESCRIPTION:xyztec at CIOE 2026 – Precision Bond Testing Leading the Optoelectronics Era \n  \nAt the 27th China International Optoelectronic Exposition (CIOE 2026)\, xyztec will showcase the latest capabilities of its bond testing equipment\, underscoring the company’s active participation in this premier global optoelectronics industry event. \n  \nWith CIOE 2026 highlighting the convergence of artificial intelligence and optoelectronics\, xyztec’s versatile bond testing systems deliver unmatched accuracy and reliability for advanced packaging\, chiplet integration\, and heterogeneous assembly. Combined with the highest level of automation\, these solutions ensure product integrity in applications ranging from high-speed optical communications to AI computing infrastructure. \n  \nxyztec warmly invites you to visit Booth 7A96 at the Shenzhen World Exhibition & Convention Center during CIOE 2026 to experience the power of precision bond testing firsthand.
URL:https://www.xyztec.com/zh-hant/event/cioe/
LOCATION:Shenzhen World Exhibition & Convention Center\, China
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20260928T080000
DTEND;TZID=UTC:20261001T170000
DTSTAMP:20260916T072124Z
CREATED:20251212T172811Z
LAST-MODIFIED:20260916T072124Z
UID:74170-1790582400-1790874000@www.xyztec.com
SUMMARY:IMAPS Symposium
DESCRIPTION:As in the past 10 years\, xyztec will once again be a silver sponsor of this year’s IMAPS Symposium which brings together the microelectronics and advanced packaging community in Boston\, MA\, to discuss the technologies shaping the next generation of semiconductor packaging. This year’s program focuses on heterogeneous integration and photonics\, with topics including advanced interconnects\, bonding technologies\, wafer-level and fan-out packaging\, reliability\, manufacturing processes\, and metrology.\n\nThe technical developments presented at IMAPS place a strong focus on understanding and verifying the performance of semiconductor packages and their interconnections. Accurate mechanical testing provides valuable insight into bond strength and failure modes\, supporting process development\, quality control\, and reliability testing.\n\nWith more than 25 years dedicated to bond testing\, xyztec brings extensive application knowledge to semiconductor and advanced packaging. This experience helps engineers find reliable and repeatable test approaches for a wide range of packaging technologies and bond types.\n\nYou are welcome to visit xyztec at booth 327 and see the machine’s capabilities live!
URL:https://www.xyztec.com/zh-hant/event/imaps-symposium/
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BEGIN:VEVENT
DTSTART;TZID=Europe/Helsinki:20261006T080000
DTEND;TZID=Europe/Helsinki:20261008T170000
DTSTAMP:20260916T074825Z
CREATED:20260317T231112Z
LAST-MODIFIED:20260916T074825Z
UID:74234-1791273600-1791478800@www.xyztec.com
SUMMARY:Expo for Electronics Manufacturing (EFX) 2026
DESCRIPTION:EFX 2026 brings the electronics manufacturing industry together in Stuttgart from October 6 to 8. As a new event for the DACH region\, EFX covers the complete electronics manufacturing process chain\, with topics including advanced packaging\, miniaturization\, automation\, smart manufacturing\, process control\, and quality assurance.\n\nFor electronics manufacturers\, consistent quality throughout the production process is essential. Mechanical bond testing provides quantitative insight into connection quality and failure modes\, helping teams evaluate processes\, monitor production consistency\, and support reliability testing.\n\nxyztec specializes in bond testing solutions for electronics and semiconductor manufacturing\, combining measurement accuracy with the flexibility required for different test applications and production needs.\n\nYou are welcome to visit xyztec in Hall 9\, booth C47 and see our bond testing technology in action.
URL:https://www.xyztec.com/zh-hant/event/expo-for-electronics-manufacturing/
LOCATION:Messe Stuttgart\, Stuttgart\, Germany
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20261013T080000
DTEND;TZID=UTC:20261015T170000
DTSTAMP:20260916T075938Z
CREATED:20251212T173742Z
LAST-MODIFIED:20260916T075938Z
UID:74174-1791878400-1792083600@www.xyztec.com
SUMMARY:Semicon West
DESCRIPTION:SEMICON West 2026 returns to San Francisco from October 13 to 15\, bringing together companies and experts from across the global semiconductor and microelectronics supply chain. The program highlights developments in advanced manufacturing\, advanced packaging\, smart manufacturing\, next-generation computing\, sustainability\, and supply chain resilience.\n\nSmart manufacturing and higher levels of automation are changing how semiconductor processes are controlled and scaled. For bond testing\, repeatability\, automated workflows\, reliable measurement data\, and integration into production environments are becoming increasingly relevant.\n\nxyztec combines reliable mechanical testing with flexible automation possibilities\, helping manufacturers apply bond testing consistently from process development through to automated production.\n\nYou are welcome to meet us in the South Hall\, Booth 1845 right next to our close partner in bonding technology F&K Delvotec\, Inc. and experience the Sigma bond testing platform firsthand.
URL:https://www.xyztec.com/zh-hant/event/semicon-west/
END:VEVENT
BEGIN:VEVENT
DTSTART;TZID=UTC:20261026T080000
DTEND;TZID=UTC:20261028T170000
DTSTAMP:20261002T074700Z
CREATED:20251221T053726Z
LAST-MODIFIED:20261002T074700Z
UID:74184-1793001600-1793206800@www.xyztec.com
SUMMARY:PSECE\, 21TH Philippine Semiconductor & Electronics Convention and Exhibition
DESCRIPTION:PSECE 2026 brings together companies\, industry experts\, and stakeholders from across the semiconductor and electronics manufacturing sector in the Philippines. Held from October 26–28 at the SMX Convention Center Manila\, the event provides a platform to showcase new technologies\, exchange knowledge\, and build connections across the industry. \n  \nTogether with our local distributor ISO Dynamique\, xyztec will be represented at PSECE with a Sigma bond tester on display. Visitors will have the opportunity to see the system in action and learn more about xyztec’s bond testing solutions for semiconductor and electronics applications. \n  \nVisit ISO Dynamique at PSECE 2026 to experience our bond testing technology live and discuss your testing applications with the team!
URL:https://www.xyztec.com/zh-hant/event/psece-21th-philippine-semiconductor-electronics-convention-and-exhibition/
LOCATION:SMX Convention Center Manila\, Pasay City\, Philippines\, Philippines
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