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UID:74207-1788940800-1789146000@www.xyztec.com
SUMMARY:CIOE
DESCRIPTION:xyztec at CIOE 2026 – Precision Bond Testing Leading the Optoelectronics Era \n  \nAt the 27th China International Optoelectronic Exposition (CIOE 2026)\, xyztec will showcase the latest capabilities of its bond testing equipment\, underscoring the company’s active participation in this premier global optoelectronics industry event. \n  \nWith CIOE 2026 highlighting the convergence of artificial intelligence and optoelectronics\, xyztec’s versatile bond testing systems deliver unmatched accuracy and reliability for advanced packaging\, chiplet integration\, and heterogeneous assembly. Combined with the highest level of automation\, these solutions ensure product integrity in applications ranging from high-speed optical communications to AI computing infrastructure. \n  \nxyztec warmly invites you to visit Booth 7A96 at the Shenzhen World Exhibition & Convention Center during CIOE 2026 to experience the power of precision bond testing firsthand.
URL:https://www.xyztec.com/zh-hant/event/cioe/
LOCATION:Shenzhen World Exhibition & Convention Center\, China
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DTSTART;TZID=UTC:20260928T080000
DTEND;TZID=UTC:20261001T170000
DTSTAMP:20260916T072124Z
CREATED:20251212T172811Z
LAST-MODIFIED:20260916T072124Z
UID:74170-1790582400-1790874000@www.xyztec.com
SUMMARY:IMAPS Symposium
DESCRIPTION:As in the past 10 years\, xyztec will once again be a silver sponsor of this year’s IMAPS Symposium which brings together the microelectronics and advanced packaging community in Boston\, MA\, to discuss the technologies shaping the next generation of semiconductor packaging. This year’s program focuses on heterogeneous integration and photonics\, with topics including advanced interconnects\, bonding technologies\, wafer-level and fan-out packaging\, reliability\, manufacturing processes\, and metrology.\n\nThe technical developments presented at IMAPS place a strong focus on understanding and verifying the performance of semiconductor packages and their interconnections. Accurate mechanical testing provides valuable insight into bond strength and failure modes\, supporting process development\, quality control\, and reliability testing.\n\nWith more than 25 years dedicated to bond testing\, xyztec brings extensive application knowledge to semiconductor and advanced packaging. This experience helps engineers find reliable and repeatable test approaches for a wide range of packaging technologies and bond types.\n\nYou are welcome to visit xyztec at booth 327 and see the machine’s capabilities live!
URL:https://www.xyztec.com/zh-hant/event/imaps-symposium/
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DTSTART;TZID=Europe/Helsinki:20261006T080000
DTEND;TZID=Europe/Helsinki:20261008T170000
DTSTAMP:20260916T074825Z
CREATED:20260317T231112Z
LAST-MODIFIED:20260916T074825Z
UID:74234-1791273600-1791478800@www.xyztec.com
SUMMARY:Expo for Electronics Manufacturing (EFX) 2026
DESCRIPTION:EFX 2026 brings the electronics manufacturing industry together in Stuttgart from October 6 to 8. As a new event for the DACH region\, EFX covers the complete electronics manufacturing process chain\, with topics including advanced packaging\, miniaturization\, automation\, smart manufacturing\, process control\, and quality assurance.\n\nFor electronics manufacturers\, consistent quality throughout the production process is essential. Mechanical bond testing provides quantitative insight into connection quality and failure modes\, helping teams evaluate processes\, monitor production consistency\, and support reliability testing.\n\nxyztec specializes in bond testing solutions for electronics and semiconductor manufacturing\, combining measurement accuracy with the flexibility required for different test applications and production needs.\n\nYou are welcome to visit xyztec in Hall 9\, booth C47 and see our bond testing technology in action.
URL:https://www.xyztec.com/zh-hant/event/expo-for-electronics-manufacturing/
LOCATION:Messe Stuttgart\, Stuttgart\, Germany
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DTSTART;TZID=UTC:20261013T080000
DTEND;TZID=UTC:20261015T170000
DTSTAMP:20260916T075938Z
CREATED:20251212T173742Z
LAST-MODIFIED:20260916T075938Z
UID:74174-1791878400-1792083600@www.xyztec.com
SUMMARY:Semicon West
DESCRIPTION:SEMICON West 2026 returns to San Francisco from October 13 to 15\, bringing together companies and experts from across the global semiconductor and microelectronics supply chain. The program highlights developments in advanced manufacturing\, advanced packaging\, smart manufacturing\, next-generation computing\, sustainability\, and supply chain resilience.\n\nSmart manufacturing and higher levels of automation are changing how semiconductor processes are controlled and scaled. For bond testing\, repeatability\, automated workflows\, reliable measurement data\, and integration into production environments are becoming increasingly relevant.\n\nxyztec combines reliable mechanical testing with flexible automation possibilities\, helping manufacturers apply bond testing consistently from process development through to automated production.\n\nYou are welcome to meet us in the South Hall\, Booth 1845 right next to our close partner in bonding technology F&K Delvotec\, Inc. and experience the Sigma bond testing platform firsthand.
URL:https://www.xyztec.com/zh-hant/event/semicon-west/
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DTSTART;TZID=UTC:20261026T080000
DTEND;TZID=UTC:20261028T170000
DTSTAMP:20261002T074700Z
CREATED:20251221T053726Z
LAST-MODIFIED:20261002T074700Z
UID:74184-1793001600-1793206800@www.xyztec.com
SUMMARY:PSECE\, 21TH Philippine Semiconductor & Electronics Convention and Exhibition
DESCRIPTION:PSECE 2026 brings together companies\, industry experts\, and stakeholders from across the semiconductor and electronics manufacturing sector in the Philippines. Held from October 26–28 at the SMX Convention Center Manila\, the event provides a platform to showcase new technologies\, exchange knowledge\, and build connections across the industry. \n  \nTogether with our local distributor ISO Dynamique\, xyztec will be represented at PSECE with a Sigma bond tester on display. Visitors will have the opportunity to see the system in action and learn more about xyztec’s bond testing solutions for semiconductor and electronics applications. \n  \nVisit ISO Dynamique at PSECE 2026 to experience our bond testing technology live and discuss your testing applications with the team!
URL:https://www.xyztec.com/zh-hant/event/psece-21th-philippine-semiconductor-electronics-convention-and-exhibition/
LOCATION:SMX Convention Center Manila\, Pasay City\, Philippines\, Philippines
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