{"id":64647,"date":"2020-06-18T07:08:19","date_gmt":"2020-06-18T07:08:19","guid":{"rendered":"https:\/\/www.xyztec.com\/docs\/smd-component-shear\/"},"modified":"2023-09-26T12:10:08","modified_gmt":"2023-09-26T12:10:08","slug":"smd-component-shear","status":"publish","type":"docs","link":"https:\/\/www.xyztec.com\/zh-hant\/knowledgecenter\/shear-tests-zh-hant\/smd-component-shear\/","title":{"rendered":"SMD component shear"},"content":{"rendered":"<h2>SMD component shear<\/h2>\n<p>While 100 \u03bcm is currently a commonly used line width for printed circuit boards in the near future, this is expected to become as low as 20 \u03bcm. Reductions in the linear scale are not linear when it comes to other aspects of board design like solder interconnects. For example, such a reduction in scale reduces solder volumes by around 50 times.<\/p>\n<p><img decoding=\"async\" class=\"alignnone size-full wp-image-16786\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/SMD_shear.jpg\" alt=\"SMD_shear\" width=\"161\" height=\"161\" \/><\/p>\n<p><!--more--><\/p>\n<p>On the other hand the intermetallic layer thickness will not be reduced, resulting in a dramatic change in the distribution of material properties within the joint and the changes within it due to aging and\/or electro migration. Similarly, surface irregularities become larger in comparison to the solder pads changing the geometry of the soldered joint and its consistency. At smaller scales stress concentration becomes more likely, increasing the risk of crack formation and them propagating through the relatively large intermetallics.<\/p>\n<p><img fetchpriority=\"high\" decoding=\"async\" class=\"alignnone size-full wp-image-16772\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/SMD_shear_force_distribution.jpg\" alt=\"SMD_shear_force_distribution\" width=\"263\" height=\"195\" \/> <img decoding=\"async\" class=\"alignnone size-full wp-image-16779\" src=\"https:\/\/www.xyztec.com\/wp-content\/uploads\/2023\/06\/SMD_shear_simulation.jpg\" alt=\"SMD_shear_simulation\" width=\"278\" height=\"214\" \/><\/p>\n<h2>How to: SMD component shear<\/h2>\n<div style=\"width: 640px;\" class=\"wp-video\"><video class=\"wp-video-shortcode\" id=\"video-64647-1\" width=\"640\" height=\"360\" preload=\"metadata\" controls=\"controls\"><source type=\"video\/mp4\" src=\"https:\/\/xyztecvideos.b-cdn.net\/SMD%20shear%20test.mp4?_=1\" \/><a href=\"https:\/\/xyztecvideos.b-cdn.net\/SMD%20shear%20test.mp4\">https:\/\/xyztecvideos.b-cdn.net\/SMD%20shear%20test.mp4<\/a><\/video><\/div>\n<p>&nbsp;<\/p>\n<h2>Sigma ideal for SMD shear<\/h2>\n<p>Xyztec have a range of tests that can determine the effect on solder joint integrity resulting from reduced scale. The Sigma\u2019s\u00a0<a href=\"https:\/\/www.xyztec.com\/condor-sigma\/rmu-versus-smu\">Revolving Measurement Unit (RMU)<\/a>\u00a0enables up to 6 different sensors or tools to be easily and quickly selected to suite a wide range of component and test requirements. Our pull, shear and tweezer sensors can include rotation, enabling the tool to be aligned to and then test components in any orientation.<\/p>\n<h2>Standards<\/h2>\n<ul class=\"bulletimg\">\n<li>AEC-Q200-006<\/li>\n<\/ul>\n<h2>Test features<\/h2>\n<ul class=\"bulletimg\">\n<li>Rotating shear tools to test components at any orientation<\/li>\n<li>Deep Access SMD test<\/li>\n<li>Fully automated testing<\/li>\n<li>Temperature-induced stress test with <a href=\"https:\/\/www.xyztec.com\/zh-hant\/%e7%94%a2%e5%93%81%e7%b7%9a\/%e5%ae%a2%e5%88%b6%e5%8c%96\/\">heater work holder<\/a><\/li>\n<li>Sensor accuracy \u00b10.075%<\/li>\n<li>Round test tool recommended<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>SMD component shear While 100  [&hellip;]<\/p>\n","protected":false},"author":18,"featured_media":58140,"parent":0,"comment_status":"open","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-64647","docs","type-docs","status-publish","has-post-thumbnail","hentry","doc_tag-smd-component-shear-zh-hant-2","doc_tag-shear-zh-hant-2","doc_category-shear-tests-zh-hant"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>How to: SMD component shear<\/title>\n<meta name=\"description\" content=\"While 100 \u03bcm is currently a commonly used line width for printed circuit boards in the near future, this is expected to become as low as 20 \u03bcm.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" 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