EFX 2026 brings the electronics manufacturing industry together in Stuttgart from October 6 to 8. As a new event for the DACH region, EFX covers the complete electronics manufacturing process chain, with topics including advanced packaging, miniaturization, automation, smart manufacturing, process control, and quality assurance.

For electronics manufacturers, consistent quality throughout the production process is essential. Mechanical bond testing provides quantitative insight into connection quality and failure modes, helping teams evaluate processes, monitor production consistency, and support reliability testing.

xyztec specializes in bond testing solutions for electronics and semiconductor manufacturing, combining measurement accuracy with the flexibility required for different test applications and production needs.

You are welcome to visit xyztec in Hall 9, booth C47 and see our bond testing technology in action.