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Force calculations

MIL-STD-883 method 2023.7 nondestructive bond pull

MIL-STD-883 method 2019.9 – Die shear strength

MIL-STD-883 method 2031.1 – Flip-chip pull-off test

MIL-STD-883 method 2004.7 – Test condition E: Lead plating integrity

MIL-STD-883 method 2004.7 – Test condition D: Solder pad adhesion for leadless chip carrier and similar devices

MIL-STD-883 method 2004.7 – Test condition C2: Stud Torque

MIL-STD-883 method 2004.7 – Test condition C1: Lead torque

MIL-STD-883 method 2004.7 – Test condition B2: Lead fatigue

MIL-STD-883 method 2004.7 – Test condition B1: Bending stress

MIL-STD-883 method 2004.7 – Test condition A1: Lead braze integrity

MIL-STD-883 method 2004.7 – Test condition A: Tension

MIL-STD-883 method 2011.9 – Bond strength (destructive bond pull test)

MIL-STD-883 method 2004.7 – Lead integrity

MIL-STD-883 method 2024.2 – Lid torque for glass-frit-sealed packages