Visit us in Tokyo this month

2020年1月17日

This week, Xyztec was at InterNepcon in Japan, Asia's leading exhibition for electronics R&D, manufacturing and packaging technology, which was held in the Tokyo Big Sight. It was a successful exhibition with 140 speakers from the industry front-runners.

Not able to give us a visit? You have a second chance to see the Sigma live in action at the MEMS SENSING & NETWORK 2020 from 29 until 31 January in the Tokyo Big Sight. Our distributors HiSOL is exhibiting (West Hall 2, 2W-S06) with Sigma, the most advanced bond tester.

FTC exhibiting the XYZTEC Sigma at CIOE 2019 in ChinaTechno Alpha and XYZTEC exhibiting the XYZTEC Sigma at InterNepcon in Japan

最新的技術摘要

2019年12月 Xyztec faces any challenge
2019年7月 Meet the world’s biggest bond testers
2019年4月 Free SMTconnect ticket? Register now
2018年8月 Is Fully Automatic Bond Testing Possible?
2017年7月 Advances in Thin, 3D and MEMS Die Bond Strength Testing
2017年5月 Shear testing copper pillar
2017年3月 Fracture strength of thin wafers and die
2017年2月 Centralized database for enhanced security and SPC options
2017年1月 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
2016年12月 Coating and film testing
2016年11月 Latest software release enables automatic grading
2016年10月 Vision enhanced materials testing

 
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