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Category: Newsletters

01-04-2025

Simplify Your High-Force Calibration with xyztec’s New Solution

Maintaining measurement accuracy is essential for reliable bond testing results. At xyztec, we are excited to announce an important upgrade to our calibration equipment that makes high-force sensor

Category: Newsletters

27-02-2025

Sigma W8: Automated Wafer Testing Made Simple

Efficient Hands-Free Bond Testing for 4″ to 8″ wafers The Sigma W8 now features an integrated wafer loader that streamlines your testing process through automated handling. This practical

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Chronologically

Category: Articles, Newsletters

August 29, 2018

Is fully automatic bond testing possible?

Advances in bond testing have progressively improved accuracy and reduced operator input but can the process be truly automated? We examine what is po

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Category: Events

März 19, 2021

First trade fairs of 2021: Semicon China & Productronica

Today is the last day to meet us at Semicon China and Productronica in the Shanghai New International Expo Centre. These exhibitions are xyztec’

Category: Events

September 24, 2020

Meet us at the Semicon Taiwan

After some viral exhibitions this year, you have the chance to meet us in person this week at the Semicon Taiwan from 23th until 25th of September at

Category: Events

Januar 17, 2020

Visit us in Tokyo this month

This week, Xyztec was at InterNepcon in Japan, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology. It was

Category: Events

November 13, 2019

Visit us at Productronica

Xyztec is exhibiting at the Productronica this week from November 12th till November 15th in München, Germany. At our booth in Hall A2.316 we present

Category: Events

Oktober 3, 2019

Xyztec at EuWoRel Berlin

This week, Xyztec was at EuWoRel at Fraunhofer-Forum Berlin to present improvements in the comprehensiveness and efficiency of experimental reliabilit

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Category: News

Februar 20, 2025

Industry Viewpoint Semiconductor Packaging News: Xyztec drives innovation in bond testing

Discover how xyztec drives innovation in bond testing! Our Global Business Development leader Dirk Schade shares insights on setting new industry stan

Category: News

Januar 28, 2025

Happy Chinese New Year 2025!

At xyztec, we want to take a moment to wish everyone celebrating worldwide a joyful and prosperous Chinese New Year!

Category: News

Januar 23, 2025

Celebrating 25 Years of Innovation in 2025!

This year, xyztec proudly marks 25 incredible years as the Technology Leader in Bond Testing Worldwide!

Category: News

Januar 2, 2025

Xyztec Celebrates Partnership with ExTripod at their “Thank You Dinner” in China

Representing Xyztec, Clyde and Jazz were invited to attend the year-end celebration hosted by ExTripod, our key distributor in China. During the event

Category: News

Oktober 2, 2024

XYZTEC exhibits at 57th IMAPS: Leading Conference for Microelectronics Packaging

As in previous years, we were pleased to be one of the 101 exhibitors at the 57th IMAPS Conference-Show in Boston. Even though the organizer chose a c

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Category: Newsletters

April 1, 2025

Simplify Your High-Force Calibration with xyztec’s New Solution

Maintaining measurement accuracy is essential for reliable bond testing results. At xyztec, we are excited to announce an important upgrade to our cal

Category: Newsletters

Februar 27, 2025

Sigma W8: Automated Wafer Testing Made Simple

Efficient Hands-Free Bond Testing for 4″ to 8″ wafers The Sigma W8 now features an integrated wafer loader that streamlines your testing

Category: Newsletters

Januar 28, 2025

Celebrating 25 Years of Bond Testing

In 2025, xyztec proudly celebrates 25 years of innovation and pushing the boundaries in bond testing technology. Over the past quarter-century, we hav

Category: Newsletters

Dezember 30, 2024

Wrapping up 2024: A Year of Innovation and Progress

As 2024 comes to a close, we at xyztec want to take a moment to reflect on the milestones we have achieved and express our heartfelt gratitude for you

Category: Newsletters

Dezember 2, 2024

Unveiling the Next Generation Sigma High Force Bond Tester

At xyztec, innovation drives everything we do. We are proud to introduce the revamped Sigma High Force (HF) bond tester, the world’s most powerf

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Unterzeichnen Sie jetzt für die Newsletter und bleiben Sie auf dem aktuellen Stand der neusten Entwicklungen in der Welt des Bond-Testens und der neusten hochentwickelten Anwendungen.

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High-tech district, Kunshan,

Jiang Su, China

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© 2025 xyztec bv

Technology leader in bond testing worldwide

Local support and parts, global presence, world-class testers

Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.

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J.F. Kennedylaan 14b
5981 XC
Panningen
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© 2025 xyztec bv