In the fast-changing world of semiconductors, the demand for precision, efficiency, and reliability is key. Chiplets and Advanced Packaging have a revolutionary impact on chip design and manufacturing
Xyztec is currently showcasing the latest innovations at the Productronica exhibition in Munich. The event, which runs from November 14 to 17, is considered the largest international event
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Advances in bond testing have progressively improved accuracy and reduced operator input but can the process be truly automated? We examine what is po
Today is the last day to meet us at Semicon China and Productronica in the Shanghai New International Expo Centre. These exhibitions are xyztec’
After some viral exhibitions this year, you have the chance to meet us in person this week at the Semicon Taiwan from 23th until 25th of September at
This week, Xyztec was at InterNepcon in Japan, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology. It was
Xyztec is exhibiting at the Productronica this week from November 12th till November 15th in München, Germany. At our booth in Hall A2.316 we present
This week, Xyztec was at EuWoRel at Fraunhofer-Forum Berlin to present improvements in the comprehensiveness and efficiency of experimental reliabilit
Xyztec is currently showcasing the latest innovations at the Productronica exhibition in Munich. The event, which runs from November 14 to 17, is cons
Our agent Extripod Electronics Technology Limited is at the China Semiconductor Packaging and Test Market & Technology Annual Conference (CSPT) fr
Xyztec was at the SEMICON show in Taiwan from September 6th to 8th in Taipei, fascinating the audience with groundbreaking innovations.
Xyztec is making a remarkable presence at SEMICON China 2023 from June 29 to July 1, 2023, at the Shanghai New International Expo Centre.
Xyztec showcased its cutting-edge solutions and expertise at the prestigious Electronic Components and Technology Conference (ECTC) held last week in
In the fast-changing world of semiconductors, the demand for precision, efficiency, and reliability is key. Chiplets and Advanced Packaging have a rev
At Xyztec, we take pride in pushing the boundaries of bond testing technology and delivering tailored solutions to meet your unique testing needs. Our
At Xyztec, we always look for ways to enhance your manufacturing processes. Our Sigma bond testers are now fully GEM300 compliant, offering you an opp
Are you seeking the ultimate bond tester that combines unparalleled accuracy, effortless setup, and cutting-edge automation capabilities? Look no furt
At Xyztec, we believe in pushing the boundaries of innovation to bring you the most advanced bond testing solutions. As the global leader in bond test
Local support and parts, global presence, world-class testers
Netherlands
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
Germany
Am Haupttor / Bürocenter
06237
Leuna
Germany
USA
170 Commerce Way
Suite 200
Portsmouth, NH 03801
United States
72/7 M.12 Soi. Soonthornwipak
Bangpla, Bangphli,
10540 Samut Prakan
Thailand
No. 157, Zhongzheng
6th St., Hukou
Township, Hsinchu
County 303,
Taiwan (R.O.C.)
Room 2012
Haichuang Mansion,
No.288 Dengyun Road,
High-tech district, Kunshan,
Jiang Su, China
Contact your
local
representative
Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
Tom Haley