As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. A shear test is one of the most common tests to perform
Developments in die result in changes to component size and thickness. The latest chip packaging designs require stacked die or silicon-to-silicon bon
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Advances in bond testing have progressively improved accuracy and reduced operator input but can the process be truly automated? We examine what is po
Today is the last day to meet us at Semicon China and Productronica in the Shanghai New International Expo Centre. These exhibitions are xyztec’
After some viral exhibitions this year, you have the chance to meet us in person this week at the Semicon Taiwan from 23th until 25th of September at
This week, Xyztec was at InterNepcon in Japan, Asia’s leading exhibition for electronics R&D, manufacturing and packaging technology. It was
Xyztec is exhibiting at the Productronica this week from November 12th till November 15th in München, Germany. At our booth in Hall A2.316 we present
This week, Xyztec was at EuWoRel at Fraunhofer-Forum Berlin to present improvements in the comprehensiveness and efficiency of experimental reliabilit
In a year filled with challenges, we’re grateful for your trust. We look forward to a new year that brings new challenges and opportunities. We wish
Last week, xyztec was in Spain for the Matelec in Madrid. The trade fair took place from Tuesday 15 November to Friday 18 November 2022. Our represent
After COVID-19, we are finally exhibiting again, and this time with our brand new booth design! So if you have not yet managed to visit this year’s
Next week, xyztec is exhibiting at the SMTconnect 2022 in Nuremberg (Germany) from 10-12th May. Get your free SMT ticket by sending a short email in
We are searching for capable, enthusiastic, and skilled people to expand our team. Xyztec is a diverse organization, operates internationally, and is
As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. A shear test is one of the most common tests to perform
Developments in die result in changes to component size and thickness. The latest chip packaging designs require stacked die or silicon-to-silicon bon
After the joyful Christmas days, the end of the year is nearby. 2022 Was a fruitful year, with once again record-breaking sales results. We have been
As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. A Tweezer Pull (TP) or a Tweezer Peel test is easy to
High-resolution cameras and flexible LED illumination are a must-have to achieve robust automation processes. We offer different cameras, adjustable L
Local support and parts, global presence, world-class testers
Netherlands
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
Germany
Am Haupttor / Bürocenter
06237
Leuna
Germany
USA
170 Commerce Way
Suite 200
Portsmouth, NH 03801
United States
Asia Pacific
72/7 M.12 Soi. Soonthornwipak
Bangpla, Bangphli,
10540 Samut Prakan
Thailand
Taiwan
No. 157, Zhongzheng
6th St., Hukou
Township, Hsinchu
County 303,
Taiwan (R.O.C.)
Suzhou
Room 2012
Haichuang Mansion,
No.288 Dengyun Road,
High-tech district, Kunshan,
Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
Tom Haley
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