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xyztec bv

How-to-Cold-Bump-Pull-CBP

How to Cold Bump Pull (CBP)?

As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. The Cold Bump Pull (CBP) test method is the ultimate solution for..
Senselektro-2022

New distributor in Hungary

As the technology leader, we strive to have local representatives all around the world to provide local support worldwide. That is why we have added a new distributor..
Kingyoup

Visit us at Semicon Taiwan

Keep up with technology developments in the world. Visit us from 28 till 30 December at the Semicon Taiwan in Taipei and find the information and resources to keep..
Custom-work-holders-FB

Continuous improvement through customer demand

70-75% of our customers are looking for custom bond testing solutions. As technology leader, we take on the frontier of bond testing from our market-leading customers. Besides focusing..
Cias-2021

Sigma live at Cias 2021 China

Xyztec was promoting the most advanced Sigma bond tester on 4 and 5 November at the Vehicle Rank Power Semiconductor annual conference in Baidu. It was a successful..
Virual-showroom-xyztec

A tour through our new virtual showroom and HQ

This newsletter gives you a taste of visiting our company headquarters (HQ). We present you with an impression of the look and feel and our assortment of Sigma..
Wire-pull

How to Wire Pull

As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. A pull test is the most common test to perform on a..
Sigma MAG bond tester

Eliminate humar error

Fully automatic bond testing Perform complex test procedures without needing operator input. A Sigma bond testing system can automatically complete shear and pull test patterns with different orientations..

It’s all about accuracy

To provide end-users with an increasingly better product that is also reliable, bond test equipment requires accuracy in the micron range. The technology evolves, and assembly methods of..

Search results in xyztec

How-to-Cold-Bump-Pull-CBP

How to Cold Bump Pull (CBP)?

As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. The Cold Bump Pull (CBP) test method is the ultimate solution for..
Senselektro-2022

New distributor in Hungary

As the technology leader, we strive to have local representatives all around the world to provide local support worldwide. That is why we have added a new distributor..
Kingyoup

Visit us at Semicon Taiwan

Keep up with technology developments in the world. Visit us from 28 till 30 December at the Semicon Taiwan in Taipei and find the information and resources to keep..
Custom-work-holders-FB

Continuous improvement through customer demand

70-75% of our customers are looking for custom bond testing solutions. As technology leader, we take on the frontier of bond testing from our market-leading customers. Besides focusing..
Cias-2021

Sigma live at Cias 2021 China

Xyztec was promoting the most advanced Sigma bond tester on 4 and 5 November at the Vehicle Rank Power Semiconductor annual conference in Baidu. It was a successful..
Virual-showroom-xyztec

A tour through our new virtual showroom and HQ

This newsletter gives you a taste of visiting our company headquarters (HQ). We present you with an impression of the look and feel and our assortment of Sigma..
Wire-pull

How to Wire Pull

As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. A pull test is the most common test to perform on a..
Sigma MAG bond tester

Eliminate humar error

Fully automatic bond testing Perform complex test procedures without needing operator input. A Sigma bond testing system can automatically complete shear and pull test patterns with different orientations..

It’s all about accuracy

To provide end-users with an increasingly better product that is also reliable, bond test equipment requires accuracy in the micron range. The technology evolves, and assembly methods of..
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