As in the past 10 years, xyztec will once again be a silver sponsor of this year's IMAPS Symposium which brings together the microelectronics and advanced packaging community in Boston, MA, to discuss the technologies shaping the next generation of semiconductor packaging. This year’s program focuses on heterogeneous integration and photonics, with topics including advanced […]
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1 Veranstaltung,EFX 2026 brings the electronics manufacturing industry together in Stuttgart from October 6 to 8. As a new event for the DACH region, EFX covers the complete electronics manufacturing process chain, with topics including advanced packaging, miniaturization, automation, smart manufacturing, process control, and quality assurance. For electronics manufacturers, consistent quality throughout the production process is […] |
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1 Veranstaltung,SEMICON West 2026 returns to San Francisco from October 13 to 15, bringing together companies and experts from across the global semiconductor and microelectronics supply chain. The program highlights developments in advanced manufacturing, advanced packaging, smart manufacturing, next-generation computing, sustainability, and supply chain resilience. Smart manufacturing and higher levels of automation are changing how semiconductor […] |
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1 Veranstaltung,PSECE 2026 brings together companies, industry experts, and stakeholders from across the semiconductor and electronics manufacturing sector in the Philippines. Held from October 26–28 at the SMX Convention Center Manila, the event provides a platform to showcase new technologies, exchange knowledge, and build connections across the industry. Together with our local distributor ISO Dynamique, […] |
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