As in the past 10 years, xyztec will once again be a silver sponsor of this year’s IMAPS Symposium which brings together the microelectronics and advanced packaging community in Boston, MA, to discuss the technologies shaping the next generation of semiconductor packaging. This year’s program focuses on heterogeneous integration and photonics, with topics including advanced interconnects, bonding technologies, wafer-level and fan-out packaging, reliability, manufacturing processes, and metrology.

The technical developments presented at IMAPS place a strong focus on understanding and verifying the performance of semiconductor packages and their interconnections. Accurate mechanical testing provides valuable insight into bond strength and failure modes, supporting process development, quality control, and reliability testing.

With more than 25 years dedicated to bond testing, xyztec brings extensive application knowledge to semiconductor and advanced packaging. This experience helps engineers find reliable and repeatable test approaches for a wide range of packaging technologies and bond types.

You are welcome to visit xyztec at booth 327 and see the machine’s capabilities live!