Die shear Shear force can vary significantly depending on the type of bond (soldered, adhesive conductive, adhesive nonconductive) and the dimensions of the die. To cover this range,..
Gold/copper ball shear The gold ball bond measurement unit can be fitted to any of our machines. Precise alignment to the bond is simple and stress free using..
SMD gull wing leads test Various approaches possible and used in the industry: Tweezer test after cutting the package out Wire pull Vector pull Inclined work holder (mehr …)
Copper pillar pull Copper pillar is rapidly being adopted as a bumped wafer interconnect. The construction is that of a Copper cylinder around 50µm in diameter and height,..
Die shear Shear force can vary significantly depending on the type of bond (soldered, adhesive conductive, adhesive nonconductive) and the dimensions of the die. To cover this range,..
Gold/copper ball shear The gold ball bond measurement unit can be fitted to any of our machines. Precise alignment to the bond is simple and stress free using..
SMD gull wing leads test Various approaches possible and used in the industry: Tweezer test after cutting the package out Wire pull Vector pull Inclined work holder (mehr …)
Copper pillar pull Copper pillar is rapidly being adopted as a bumped wafer interconnect. The construction is that of a Copper cylinder around 50µm in diameter and height,..