How to: Shear This manual advises what to consider and how to perform an optimal shear test. The guide touches topics on shear tool design, tool quality, tool..
Why test bonds? Electrical and thermal bonds are such an integral part of electronic and semiconductor construction that they may often be taken for granted. Modern electronic assembly..
Lid torque The purpose of this test is to determine the shear strength of the seal of glass-frit-sealed microelectronic packages. This is a destructive test. (more…)
SMD component shear While 100 μm is currently a commonly used line width for printed circuit boards in the near future, this is expected to become as low..
Passivation layer shear As gold ball bonding geometries reduce, so does the height of the ball bond. The thickness of the passivation layer, though, remains the same. This..
Cavity shear Cavity Shear tools have a semi-cylindrical recess (cavity) that distributes the shear load on a ball over a much larger surface area. This reduces ball deformation..
Total ball shear/zone shear Total Ball Shear (TBS) or zone shear tests all or many rows of balls in one operation, producing more bond or pad failures. Using..
Ribbon shear Ribbon shear test and wire pull tests are used to assess the quality of bonded aluminum or copper wire and ribbons. The ribbon shear test is..
Wedge shear Wedge shear test and wire pull tests are used to assess the quality of bonded aluminum or copper wire and ribbons. The wedge shear test is..
Solder ball shear The xyztec Solder Ball bond measurement unit can be fitted to any of our machines. Precise alignment to the bond is simple and stress-free using..
How to: Shear This manual advises what to consider and how to perform an optimal shear test. The guide touches topics on shear tool design, tool quality, tool..
Why test bonds? Electrical and thermal bonds are such an integral part of electronic and semiconductor construction that they may often be taken for granted. Modern electronic assembly..
Lid torque The purpose of this test is to determine the shear strength of the seal of glass-frit-sealed microelectronic packages. This is a destructive test. (more…)
SMD component shear While 100 μm is currently a commonly used line width for printed circuit boards in the near future, this is expected to become as low..
Passivation layer shear As gold ball bonding geometries reduce, so does the height of the ball bond. The thickness of the passivation layer, though, remains the same. This..
Cavity shear Cavity Shear tools have a semi-cylindrical recess (cavity) that distributes the shear load on a ball over a much larger surface area. This reduces ball deformation..
Total ball shear/zone shear Total Ball Shear (TBS) or zone shear tests all or many rows of balls in one operation, producing more bond or pad failures. Using..
Ribbon shear Ribbon shear test and wire pull tests are used to assess the quality of bonded aluminum or copper wire and ribbons. The ribbon shear test is..
Wedge shear Wedge shear test and wire pull tests are used to assess the quality of bonded aluminum or copper wire and ribbons. The wedge shear test is..
Solder ball shear The xyztec Solder Ball bond measurement unit can be fitted to any of our machines. Precise alignment to the bond is simple and stress-free using..