IMS: IEEE International MTT Symposia
Boston, Massachusetts, USA
Boston, Massachusetts, USA
Tokyo Big Sight, Japan
Wuxi, Jiangsu, China
Bitec, Bangkok, Thailand
ICEPT (China International Conference on Electronic Packaging Technology) has long been a representative academic and technical exchange platform in the global electronic packaging field and is also regarded as an important international event by the industry. This conference is expected to gather globally renowned wafer fabs, OSAT packaging and testing plants, advanced packaging supply chain, […]
PCIM Asia Shenzhen 2026, as an annual event for power electronics, smart sports, and renewable energy management that has been deeply rooted in Asia for more than 20 years, is the core link connecting the industry chain with cutting-edge scientific research achievements. This exhibition focuses on high-value application areas such as SiC/GaN wide ban charged […]
SEMICON Taiwan 2026 will be held at the Nangang Exhibition Center in Taipei in early September, continuing to highlight its position as an important communication platform for the global semiconductor industry. The exhibition gathers key links such as wafer manufacturing, equipment, materials, advanced packaging, and smart manufacturing, and has become an important indicator for observing […]
xyztec at CIOE 2026 - Precision Bond Testing Leading the Optoelectronics Era At the 27th China International Optoelectronic Exposition (CIOE 2026), xyztec will showcase the latest capabilities of its bond testing equipment, underscoring the company’s active participation in this premier global optoelectronics industry event. With CIOE 2026 highlighting the convergence of artificial intelligence […]
As in the past 10 years, xyztec will once again be a silver sponsor of this year's IMAPS Symposium which brings together the microelectronics and advanced packaging community in Boston, MA, to discuss the technologies shaping the next generation of semiconductor packaging. This year’s program focuses on heterogeneous integration and photonics, with topics including advanced […]
EFX 2026 brings the electronics manufacturing industry together in Stuttgart from October 6 to 8. As a new event for the DACH region, EFX covers the complete electronics manufacturing process chain, with topics including advanced packaging, miniaturization, automation, smart manufacturing, process control, and quality assurance. For electronics manufacturers, consistent quality throughout the production process is […]