Brochures and flyers 14 Flyer “Why Sigma” Flyer applications Flyer automation Flyer customization Flyer RMU Flyer Sigma
Brochures old 23 Presentation Sigma TC Presentation Sigma JP Flyer self aligning shear tool Flyer Impact Measurement Unit Company profile xyztec TC Company profile xyztec SC
Case studies 4 Danfoss Fully automated LED wafer testing Heraeus rates xyztec as excellent supplier Large heater stage on Sigma W12
External software 4 IDS uEye Camera driver – x64 Teamviewer Sigma USB driver General-USB device driver
General publications 14 The Rigid Pendulum – an Antique but Evergreen Physical Model xyztec servo motor performance tests Investigation of Solder Joint Reliability through Impact Fatigue Loading The science of High Speed Impact Testing The Importance of Bond Strength Measurement Effect of Temperature on Transition in Failure Modes for HF
Guidelines 15 MIL-STD-883 method 2024.2 – Lid torque for glass-frit-sealed packages MIL-STD-883 method 2004.7 – Lead integrity MIL-STD-883 method 2011.9 – Bond strength (destructive bond pull test) MIL-STD-883 method 2004.7 – Test condition A: Tension MIL-STD-883 method 2004.7 – Test condition A1: Lead braze integrity MIL-STD-883 method 2004.7 – Test condition B1: Bending stress
Brochures old 23 Brochure Condor 150 4 HF Brochure Condor EZ Brochure Condor EZ SC Brochure Condor EZ TC Brochure Sigma Brochure Sigma HF Brochure Sigma KR Brochure Sigma Lite Brochure Sigma Lite SC Brochure Sigma MAG
Case studies 4 Danfoss Fully automated LED wafer testing Heraeus rates xyztec as excellent supplier Large heater stage on Sigma W12
External software 4 General-USB device driver IDS uEye Camera driver – x64 Sigma USB driver Teamviewer
Software and manuals 7 Kurzanleitung Sigma Software (Deutsch) 2021.DV01 Manual Sigma HF 2021 Manual Sigma MAG 2021.V01 Manual Sigma Software 2026.V01 Sigma Setup v5.16 – build 8018, 64 bit Sigma Setup v5.16 – build 8738, 64 bit Sigma Setup v5.17 – build 23339.1, 64 bit (no USB 2 camera support)
General publications 14 Alternative Testing Methods for Electronic Assemblies Autograding without any assistance Effect of Temperature on Transition in Failure Modes for HF Investigation of Solder Joint Reliability through Impact Fatigue Loading Mechanical Strength Evaluation of Solar Cell Solder Joints by Developing a New Test Method Red Dot Award xyztec Scratch Testing / Coating Testing Technical Informer: Measuring Hysteresis The Importance of Bond Strength Measurement The Rigid Pendulum – an Antique but Evergreen Physical Model
Brochures and flyers 14 Brochure Sigma bond testers (bundle) Flyer “Why Sigma” Flyer “Your operators will love it” Flyer applications Flyer automation Flyer customization Flyer RMU Flyer Sigma Flyer Sigma HF Flyer Sigma MAG
Publications 7 Bond Test Measurement Accuracy Innovations in solar cell bond testing Is fully automatic bond testing possible? Technical Informer: Solar Cell Ribbon Peel Testing USB Tweezers: Mechanical stress test for component solder joints and bonding wires Why test bonds? Xyztec introduces Battery Module Bond Testing (BMBT)
Guidelines 15 Force calculations MIL-STD-883 method 2004.7 – Lead integrity MIL-STD-883 method 2004.7 – Test condition A: Tension MIL-STD-883 method 2004.7 – Test condition A1: Lead braze integrity MIL-STD-883 method 2004.7 – Test condition B1: Bending stress MIL-STD-883 method 2004.7 – Test condition B2: Lead fatigue MIL-STD-883 method 2004.7 – Test condition C1: Lead torque MIL-STD-883 method 2004.7 – Test condition C2: Stud Torque MIL-STD-883 method 2004.7 – Test condition D: Solder pad adhesion for leadless chip carrier and similar devices MIL-STD-883 method 2004.7 – Test condition E: Lead plating integrity
Industries 13 Aerospace Automotive Display Electronic packaging Light-Emitting Diodes (LED) Medical Mobile devices Power devices Renewable energy Semiconductor
Other tests 9 Cantilever beam Creep Deep access Fatigue High speed impact Lead integrity/micro torsion Lid torque Scratch/coating Spring rigidity
Shear tests 11 Cavity shear Copper pillar shear Die shear Gold/copper ball shear Overhanging die shear Passivation layer shear Ribbon shear SMD component shear Solder ball shear Total ball shear/zone shear
Pull tests 10 Cold bump pull (CBP) Copper pillar pull Lid pull Ribbon pull SMD component pull SMD gull wing pull Stud (die) pull Tweezer pull Vector pull Wire pull
