Brochures and flyers 15 Brochure Sigma bond testers (bundle) Company Profile 2026 Flyer “Why Sigma” Flyer “Your operators will love it” Flyer applications
Brochures old 23 Brochure Condor 150 4 HF Brochure Condor EZ Brochure Condor EZ SC Brochure Condor EZ TC Brochure Sigma
Case studies 4 Danfoss Fully automated LED wafer testing Heraeus rates xyztec as excellent supplier Large heater stage on Sigma W12
External software 5 General-USB device driver IDS peak version 2.19 IDS uEye Camera driver – x64 Sigma USB driver Teamviewer
General publications 14 Alternative Testing Methods for Electronic Assemblies Autograding without any assistance Effect of Temperature on Transition in Failure Modes for HF Investigation of Solder Joint Reliability through Impact Fatigue Loading Mechanical Strength Evaluation of Solar Cell Solder Joints by Developing a New Test Method
Guidelines 15 Force calculations MIL-STD-883 method 2004.7 – Lead integrity MIL-STD-883 method 2004.7 – Test condition A: Tension MIL-STD-883 method 2004.7 – Test condition A1: Lead braze integrity MIL-STD-883 method 2004.7 – Test condition B1: Bending stress
Publications 8 Bob Sykes joins xyztec Bond Test Measurement Accuracy Innovations in solar cell bond testing Is fully automatic bond testing possible? Technical Informer: Solar Cell Ribbon Peel Testing
Shear tests 11 Cavity shear Copper pillar shear Die shear Gold/copper ball shear Overhanging die shear
Software and manuals 7 Kurzanleitung Sigma Software (Deutsch) 2021.DV01 Manual Sigma HF 2021 Manual Sigma HF 2025 Manual Sigma MAG 2021.V01 Manual Sigma Software 2026.V01
