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How to: Cold Bump Pull (CBP)

How to: Tweezer Pull

如何: 进行推力测试

Electronic packaging

Electronic assembly materials development is an ongoing process to support next-generation package design and manufacturing practices.

Bond testing is a fundamental component in demonstrating that novel packaging and materials can perform at the standard required by their end-use.


From lead-free, RoHS-compliant solder alloy development to novel polymer materials, bond testing is a critical element in packaging assembly process development and optimization. Once your electronic packages are in production, our best-in-class Sigma bond testers are ideal for supporting the high-precision testing required by production quality teams to monitor bonding performance on the manufacturing line.


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