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Electronic assembly materials development is an ongoing process to support next-generation package design and manufacturing practices.
Bond testing is a fundamental component in demonstrating that novel packaging and materials can perform at the standard required by their end-use.
From lead-free, RoHS-compliant solder alloy development to novel polymer materials, bond testing is a critical element in packaging assembly process development and optimization. Once your electronic packages are in production, our best-in-class Sigma bond testers are ideal for supporting the high-precision testing required by production quality teams to monitor bonding performance on the manufacturing line.
Local support and parts, global presence, world-class testers
J.F. Kennedylaan 14b5981 XC PanningenThe Netherlands
Schäferei 1806237 LeunaOT GünthersdorfGermany
72/7 M.12 Soi. SoonthornwipakBangpla, Bangphli,10540 Samut PrakanThailand
No. 157, Zhongzheng 6th St., Hukou Township, Hsinchu County 303, Taiwan (R.O.C.)
Room 2012 Haichuang Mansion, No.288 Dengyun Road, High-tech district, Kunshan, Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
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