Home » KnowledgeCenter » Industries » Electronic packaging
Electronic assembly materials development is an ongoing process to support next-generation package design and manufacturing practices.
Bond testing is a fundamental component in demonstrating that novel packaging and materials can perform at the standard required by their end-use.
From lead-free, RoHS-compliant solder alloy development to novel polymer materials, bond testing is a critical element in packaging assembly process development and optimization. Once your electronic packages are in production, our best-in-class Sigma bond testers are ideal for supporting the high-precision testing required by production quality teams to monitor bonding performance on the manufacturing line.
Tom Haley
Dive straight into the feedback!Login below and you can start commenting using your own user instantly
If a page is not available in your language, we automatically show the default English page. Your browser is set to ENGLISH. Check your browser settings if you wish to access our website in a different language.