Electronic packaging #

Electronic assembly materials development is an ongoing process to support next-generation package design and manufacturing practices.

Bond testing is a fundamental component in demonstrating that novel packaging and materials can perform at the standard required by their end-use.

From lead-free, RoHS-compliant solder alloy development to novel polymer materials, bond testing is a critical element in packaging assembly process development and optimization. Once your electronic packages are in production, our best-in-class Sigma bond testers are ideal for supporting the high-precision testing required by production quality teams to monitor bonding performance on the manufacturing line.