logo xyztec

How to: Cold Bump Pull (CBP)

How to: Tweezer Pull

Sample measurement tests

Surface Mount (SMD)

Mounting functional devices directly onto the printed circuit board (PCB) surface has been a staple of the electronics hardware assembly industry for decades. We repeatedly demonstrate our ability to meet the needs of this legacy industry.


Surface mount technology (SMT) offers multiple applications for bond testing methodologies:

  • Ensuring robust solder joint formation in component attachment after reflow processing
  • Measuring underfill material bond strength
  • Evaluating through-hole component soldering
  • Testing interconnect durability after bend-testing of PCB substrate near a surface-mount device,
  • And way more


A Sigma can support all test requirements of surface mount technologies by offering a 200 kgf testing range, multi-sensor capability with our unique RMU, and full automation capabilities to minimize operator deficiency throughout the test process.

Contact Us

Clyde Chen


    Follow us on: 

    © 2023 xyztec b.v.