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How to: Cold Bump Pull (CBP)

How to: Tweezer Pull

Sample measurement tests


Advances in electronics packaging technologies and digital connectivity enable improvements to medical devices that change the lives of millions of people worldwide.


These products demand the highest reliability, and the combination of miniaturized circuitry and semiconductor packages necessitates robust testing capabilities to ensure assembly performance.


Medical device manufacturers continue research on fundamental materials and bonding processes to create devices that make a difference. Xyztec continues to support these teams’ bond testing needs by providing outstanding solutions for these demanding applications, including thin-film adhesion strength, device (i.e. MEMS) bond strength, adhesive bond strength, and more.


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