Elektronische Baugruppen und Leiterplatten (EBL) 12th Electronic Assemblies and PCBs Conference The DVS, with its research association, organizes industrial research in the field of assembly and connection technology. Together with the GMM, it is the forum for experts from industry and research, with the EBL as the most important German-speaking conference in electronic assembly manufacturing.
Device Packaging The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). DPC 2024 will be co-located with the Workshop on Advanced Packaging for Medical Microelectronics (March 21-22). […]
SEMICON China connects you to the world's fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China. About SEMI SEMI connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology […]
The meeting place for the whole industrial ecosystem. As a cornerstone in reindustrialization, Global Industrie symbolizes the commitment and pride of industrial players. A Showcase for Regions, know-how and the essential presence of industry in our everyday lives, it is above all a place to meet and do business for those who are shaping today’s and tomorrow’s […]
A Premier Event.... The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The technical program contains papers covering […]
Fraunhofer Institute for Microstructure of Materials and Systems IMWS
The trade fair for the electronic production community […]
China ID Packaging & Testing Industry Chain Innovat […]
Semiconductors are the foundation of the smart future. […]
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Herbert Stuermann
