A pull test is the most common test to perform on a bond tester. It is performed by applying an upward force under gold, aluminum or copper wires or ribbons and effectively pulling it away from the substrate moving the Z-stage until the bond breaks (destructive) or a pre-defined force is reached (non-destructive).
Click the play button to see a pull test type video or read more by clicking on the link below.
Local support and parts, global presence, world-class testers
Netherlands
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
Germany
Schäferei 18
06237 Leuna
OT Günthersdorf
Germany
USA
Asia Pacific
72/7 M.12 Soi. Soonthornwipak
Bangpla, Bangphli,
10540 Samut Prakan
Thailand
Taiwan
No. 157, Zhongzheng
6th St., Hukou
Township, Hsinchu
County 303,
Taiwan (R.O.C.)
Suzhou
Room 2012
Haichuang Mansion,
No.288 Dengyun Road,
High-tech district, Kunshan, Jiang Su, China
Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
Follow us on:
© 2021 xyztec bv
Tom Haley
Dive straight into the feedback!Login below and you can start commenting using your own user instantly