Pull tests

Test types

Upwards (Z-axis)

Pull

A pull test is the most common test to perform on a bond tester. It is performed by applying an upward force under gold, aluminum or copper wires or ribbons and effectively pulling it away from the substrate moving the Z-stage until the bond breaks (destructive) or a pre-defined force is reached (non-destructive).

Pull
Pull hook

Applications

  • Cross sectional shape of thin and thick wires
  • Small geometry (ultra fine pitch)
  • Ribbons either round or rectangular

Tools

  • Standard 90° hooks
  • Customized hooks

Pull test types

Click the play button to see a pull test type video or read more by clicking on the link below.

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SMD component pull

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Tom Haley


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