Shear tests

Test types

Lateral load applied normal to face of component

The most common test is a shear test. Performing a shear test, a bond tester applies lateral load to the sample and shears the bond from it surface.

The choice between pull or shear testing depends on the application and the test objectives. We have experience with different test types and can advise you on how to test in order to get the best information for your quality assurance process.

Applications

Wires at bond 1 or bond 2
SMT components
BGA’s
Flip chips
Bump shear on underside of devices
Stacked chips (2.5d builds)
Diodes
LED
Materials testing in adhesive design and performance
Automative industry
Ultrasonic weld performance testing
Power electronics
IGBT’s

Tools

Standard shear tools
Customized shear tools

Standards

JESD22-B116 – Au Ball Shear
JEDEC JESD22-B117 – Solder Ball Shear
ASTM F1269 – Ball Bond Shear

Shear test types

Click the play button to see a shear test type video or read more by clicking on the link below.

Cavity shear

Copper pillar shear

Copper tab/conductor

Die shear

Gold/copper ball shear

Overhanging die shear

Passivation layer shear

Ribbon shear

Solder ball shear

SMD component shear

Total ball shear/zone shear

Wedge shear

Netherlands

J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands

Germany

Schäferei 18
06237 Leuna
OT Günthersdorf
Germany

USA

33 South Main St. Unit #1
PO box 2189
Wolfeboro, NH 03894
United States

Asia Pacific

72/7 M.12 Soi. Soonthornwipak
Bangpla, Bangphli,
10540 Samut Prakan
Thailand

Taiwan

No. 157, Zhongzheng
6th St., Hukou
Township, Hsinchu
County 303,
Taiwan (R.O.C.)

Suzhou

Room 2012
Haichuang Mansion,
No.288 Dengyun Road,
High-tech district, Kunshan, Jiang Su, China

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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.

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xyztec HQ

J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands

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