イベント

The 55th International Symposium on Microelectronics is […]

The 20th China Semiconductor Packaging Test Technology […]

International Trade Fair for the Electrical and Electro […]

BioNanoMed 2023 - Nanotechnology enables Personalized M […]

The trade fair for the electronic production community SMTconnect is the only trade fair for electronic production in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere.

2023 IEEE 73rd Electronic Components and Technology Conference The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT). The […]

SEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the most qualified audience of industry professionals in China. About SEMI SEMI is a global industry association serving companies that provide equipment materials and services used to […]

FIEE – International Trade Show of the Electrical, Electronic, Power, Automation and Connectivity Industry, the biggest and most complete event in the sector, now has a new proposal, featuring a segmented show focused on the evolution of the electrical and electronics sectors, presenting Technologies and Solutions for Efficiency and Productivity, Power Generation and Connectivity. The Show […]

The 56th International Symposium on Microelectronics is being organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held in San Diego, California. This year's Symposium will  feature 5 technical tracks, plus our Interactive Poster Session. The technical program will span three days of sessions with emphasis on SiP/Design/Manufacturing Optimization; Wafer Level/Panel Level (Advanced RDL); High Performance/High Reliability; Advanced […]