xyztec at CIOE 2026 – Precision Bond Testing Leading the Optoelectronics Era

At the 27th China International Optoelectronic Exposition (CIOE 2026), xyztec will showcase the latest capabilities of its bond testing equipment, underscoring the company’s active participation in this premier global optoelectronics industry event.

With CIOE 2026 highlighting the convergence of artificial intelligence and optoelectronics, xyztec’s versatile bond testing systems deliver unmatched accuracy and reliability for advanced packaging, chiplet integration, and heterogeneous assembly. Combined with the highest level of automation, these solutions ensure product integrity in applications ranging from high-speed optical communications to AI computing infrastructure.

xyztec warmly invites you to visit Booth 7A96 at the Shenzhen World Exhibition & Convention Center during CIOE 2026 to experience the power of precision bond testing firsthand.