PCIM Asia Shenzhen 2026, as an annual event for power electronics, smart sports, and renewable energy management that has been deeply rooted in Asia for more than 20 years, is the core link connecting the industry chain with cutting-edge scientific research achievements.
This exhibition focuses on high-value application areas such as SiC/GaN wide ban charged crystals, power transistor components and modules, automotive electronics/new energy vehicles, and electrified transportation industry chains.

In the field of power transistor and automotive grade device packaging and testing, xyztec has always maintained a leading position in the global and Chinese markets with its powerful high thrust/high tensile testing technology, ultra-high reproducibility accuracy, and ultimate automation integration capabilities, setting an industry benchmark for the packaging reliability of power modules.

At the PCIM Asia Shenzhen 2026 site, xyztec will collaborate with its important agent in China, ExTripod, to publicly showcase its flagship fully automatic push-pull force testing equipment.
A dynamic demonstration will be conducted on site to demonstrate an efficient automated push-pull force testing solution for power modules, including thick aluminum wire/copper strip tension, as well as high-force die shear testing. The demonstration will highlight how these solutions effectively address the quality control challenges associated with high-power device manufacturing.

You are welcome to visit our booth and learn more about our latest bond testing solutions.