A pull test is the most common test to perform on a bond tester. It is performed by applying an upward force under gold, aluminum or copper wires or ribbons and effectively pulling it away from the substrate moving the Z-stage until the bond breaks (destructive) or a pre-defined force is reached (non-destructive).
Click the play button to see a pull test type video or read more by clicking on the link below.
Follow us on:
Herbert Stuermann
