CAM-Workshop 2024 (Germany)
Fraunhofer Institute IMWSFraunhofer Institute for Microstructure of Materials an […]
Fraunhofer Institute for Microstructure of Materials an […]
The trade fair for the electronic production community […]
China ID Packaging & Testing Industry Chain Innovat […]
Semiconductors are the foundation of the smart future. […]
Semiconductor Packaging & Testing Expo
Phoenix is set to become a tech powerhouse in 2025 with the arrival of SEMICON West, the premier microelectronics exhibition in North America. The first show, at the Phoenix Convention Center, is October 7-9, 2025, then it returns in 2027 and 2029. SEMI's decision to host SEMICON West in Phoenix highlights a strategic shift to […]
Asia's Leading Electronics Tech. Show Launched more than 30 years ago, NEPCON JAPAN has grown together with the Japanese & Asian electronics industries. The show specialised in essential areas for electronics manufacturing and R&D, and increased its value as an exhibition representing Asia's leading one-stop venue for all those involved in the electronics industry. Techno […]
IMAPS Wire Bonding 2025 Workshop & Tabletop Exhibition The International Microelectronics Assembly and Packaging Society (IMAPS) will host an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding ~ February 3-5, 2025 in San Diego, California.
The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6, 2025. It is an international event organized by the International Microelectronics Assembly and Packaging Society and a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these […]