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Advances in electronics packaging technologies and digital connectivity enable improvements to medical devices that change the lives of millions of people worldwide.
These products demand the highest reliability, and the combination of miniaturized circuitry and semiconductor packages necessitates robust testing capabilities to ensure assembly performance.
Medical device manufacturers continue research on fundamental materials and bonding processes to create devices that make a difference. Xyztec continues to support these teams’ bond testing needs by providing outstanding solutions for these demanding applications, including thin-film adhesion strength, device (i.e. MEMS) bond strength, adhesive bond strength, and more.
Local support and parts, global presence, world-class testers
J.F. Kennedylaan 14b5981 XC PanningenThe Netherlands
Schäferei 1806237 LeunaOT GünthersdorfGermany
72/7 M.12 Soi. SoonthornwipakBangpla, Bangphli,10540 Samut PrakanThailand
No. 157, Zhongzheng 6th St., Hukou Township, Hsinchu County 303, Taiwan (R.O.C.)
Room 2012 Haichuang Mansion, No.288 Dengyun Road, High-tech district, Kunshan, Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.