How to: Cold Bump Pull (CBP)

How to: Shear

How to: Tweezer Pull

Sample measurement tests


Electronics systems for automotive applications provide a wide range of technical teams opportunities to optimize and track bonding performance.


By 2030, it is forecast that approximately 50% of a new automobile’s cost will be associated with the electronics systems in the vehicle. This forecast includes the suite of sensors to support advanced drive-assistance systems (ADAS) along with the electronics systems that make up novel electric vehicle (EV) and hybrid vehicle (HV) powertrain solutions.


Test applications in the automotive supply chain are extremely diverse and cover a broad range of force and size requirements for bond testing systems. From specialized alloy welds to heavy wire bonds on battery modules, xyztec has been able to leverage our expert design capabilities to meet the requirements of this diverse and growing ecosystem of test applications.


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Dirk Schade