Typically this test is done by stud pull and gluing the lid and base of the device to two blocks of metal with screw holes in them that are used to apply the pull load. While xyztec of course offers excellent solutions for stud pull, the mechanical grip method is also worth considering for many bond tester users.
Mechanical grip method
The new xyztec mechanical grip method consists of reusable parts that are accurately aligned the test load to the device. They can be quick release and in many cases handle a range of similar devices.
The lid and base of the device are gripped along their edges by side clamps.
The grippers can be screw fixed as is this example or quick release with a single lever operation. When the gap between the lid and its base is very small some sample preparation will probably be required. In such cases a bench mounted preparation jig can be provided.
The bond can also easily be tested at elevated temperature by mounting either the lid clamp or base clamp onto a heated platform. See our extensive range of work holders.
- Eliminates need for disposable metal block/studs and adhesives
- No handling of adhesives in production environment with the risk of clean room contamination together with operator and equipment safety
- Very precise alignment of the studs to the device
- Quick to perform
- Sensor accuracy ±0.075%