SEMICON Taiwan 2026 will be held at the Nangang Exhibition Center in Taipei in early September, continuing to highlight its position as an important communication platform for the global semiconductor industry.
The exhibition gathers key links such as wafer manufacturing, equipment, materials, advanced packaging, and smart manufacturing, and has become an important indicator for observing the global semiconductor supply chain layout, technological upgrading, and industrial cooperation.

This year’s exhibition mainly focuses on smart manufacturing and advanced packaging, and has established a special zone for wafer smart manufacturing for the first time, showcasing cutting-edge applications such as automation, robotics, digital clones, and industrial AI, reflecting the continuous evolution of the industry towards high efficiency, high integration, and high precision.

xyztec has been deeply involved in wafer level and packaging testing applications, with its main customer base covering top tier customers in semiconductor packaging, wafer level packaging, Chiplets, and high-precision bond testing; In the field of automated testing in Taiwan, xyztec has established a stable market reputation with its automated Bond Tester and integration capabilities.

At Semicon Taiwan xyztec will publicly unveil its latest equipment: the Sigma Nano!
This model focuses on higher positioning accuracy, more precise and stable shear height control, and true corresponding micrometer packaging testing capabilities, targeting the advanced packaging and high-density interconnect application market, which is one of the highlights of this exhibition.

You are welcome to visit booth K2176 on the first floor, and booth N0868 on the fourth floor of the Nangang Exhibition Center.