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As forerunners in bond testing, we aim to spread knowledge about bond testing in the industry. We offer how-to’s on Wire Pull (WP), Cold Bump Pull (CBP), and Tweezer Pull (TP) and access to the relevant MIL-STD-883 standards.
Feel free to use these guides to bond testing. Please reach out if you have any comments or specific questions regarding the application or your samples.
This how-to on wire pull (WP) is a guide advising what to consider and how to perform a correct wire pull test. The main focus of this manual is on wire and ribbon pulls using wire hooks. Loop height measurement is also covered. The manual briefly touches on related topics like tweezer pull and peel testing of wires, which is the subject of a separate how-to.
This how-to on shear advises what to consider and how to perform an optimal shear test. The guide touches topics on shear tool design, tool quality, tool alignment, how to hold the sample and most common failure modes for gold balls, copper balls, solder balls, die shear, and wedges. The guide also covers cavity, passivation, zone, vector, and SMT lead shear.
This how-to on Tweezer Pull (TP) is a guide advising what to consider and how to perform a Tweezer Pull test or a Tweezer Peel test. Tweezer pull and peel tests usually are not challenging to do if you own the right equipment.
The guideline on Cold Bump Pull testing, a type of tweezer testing on solder balls or bumps, is available in a separate how-to.
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J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
ドイツ
Am Haupttor / Bürocenter
06237
Leuna
Germany
アメリカ
170 Commerce Way
Suite 200
Portsmouth, NH 03801
United States
アジア・環太平洋
72/7 M.12 Soi. Soonthornwipak
Bangpla, Bangphli,
10540 Samut Prakan
Thailand
台湾
No. 157, Zhongzheng
6th St., Hukou
Township, Hsinchu
County 303,
Taiwan (R.O.C.)
蘇州
Room 2012
Haichuang Mansion,
No.288 Dengyun Road,
High-tech district, Kunshan, Jiang Su, China
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
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Herbert Stuermann
