search

xyztec bv

Cold Bump Pull (CBP)

Pull testing bumped wafers

Whilst the construction of wafer bumps take many forms testing their quality by bond testing requires either pull or shear testing. Shear testing has the advantage of being..
SMT 2016

SMT 2016 all about automation

Last week, xyztec attended the SMT show in Nürnberg, Germany. The technology leader in bond testing presented itself in two places, namely at booth 7A- 507 and at..

Search results in xyztec

Cold Bump Pull (CBP)

Pull testing bumped wafers

Whilst the construction of wafer bumps take many forms testing their quality by bond testing requires either pull or shear testing. Shear testing has the advantage of being..
SMT 2016

SMT 2016 all about automation

Last week, xyztec attended the SMT show in Nürnberg, Germany. The technology leader in bond testing presented itself in two places, namely at booth 7A- 507 and at..