human error

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Robotic handling ensures safe load and unload of applications and avoids handling error and damage. We offer handlers for:
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Easy programming

Easy programming

The open Sigma software enables easy programming of total automation steps, positions, and commands. The automation editor employs camera visualization and intelligent wizards.

  • Wafer map import
  • Matrix selection
Wafer map
Smart vision

Smart vision

See the unseen with up to 3 live camera options. Bring out the features of interest with images or videos using high-resolution cameras, flexible LED illumination, and fantastic image processing options. Well shot images can be the input for automatic grading.
  • Multiple cameras
  • Image processing
  • Optical 3D function
Image processing
Tool alignment

Tool alignment

Precise tool alignment is essential to test the correct bonds correctly. Concentricity correction achieves tool eccentricities less than 5 µm, and unique tool designs can be of help during alignment. We offer solutions in customized hook foot lengths or a self-aligning shear tool, which corrects for any tiny but important angular difference between tool and sample. Using the camera and deep access tooling allows you to test complex sample architecture. Switch between different tools in seconds with our unique rotating 6-in-1 test head RMU.

Deep access alignment
Fiducial recognition

Fiducial recognition

Define recognizable shapes, patterns, or marks as a global or local reference for positioning and automatic tool alignment.

Make sure your sample is in position to test the correct bonds. Fiducials help to correct for any displacements. With camera visualization, it is easy to define recognizable shapes, patterns, or marks as a global or local reference.

Fiducial recognition
WIre detection

Wire detection

Recognition of components and fine pitch wires that are swept out of position due to process tolerances or part handling.

Teach the exact position between the first and second bond using camera visualization and the AOI editor. Simply correct missing wires or recognition problems during the automation cycle or after via extensive reports.

Wire detection 1
Grading run

Grading run

Traditionally, operators do the grading after each test. The Sigma offers 2 alternatives to make this process more efficient and consistent.
  • The operator does all the gradings in one
    step after a sequence of tests, using the microscope or an offset camera.
  • A Sigma can take it one step further and make automatic determinations of the failure modes (autograding).
Grading overview ball shear
Auto grading

Auto grading

Many leading manufacturers automatically grade the failure modes of the test result images. For ball shear, smart optical inspection algorithms calculate the percentage of the remaining bond material in the region of interest and identify the failure mode using classifications. You can also automatically grade other types of bond failures.


Operators do not need to fulfill assessments by accepting or editing the failure modes at the end of an automation run. With machine vision software and deep learning, we train a neural network to do the image processing for you. By classifying the failure mode criteria beforehand, image recognition is ready to perform automatic grading without any assistance.

Auto grading with results
Image measurement

Image measurement (AOI)

Quickly measure manually in captured images by drawing lines or shapes (rectangles, ellipses) and measure:

  • Distances
  • Lengths
  • Widths
  • Heights
  • Areas

For more advanced image processing, filtering, segmentation, and detection of shapes, you can use Automated Optical Inspection (AOI). AOI allows you to examine test results and to measure features between objects, and angles.
image measurement
Data communication

Data communications

Automatically store the reports after several measurements. The editor supports export to file, serial port, clipboard, and other protocols such as SECS/GEM.

Share between systems

  • Share test settings and data among machines
  • Centralized back up
  • Storage capacity
  • Historical information records
  • Data integrity


SECS/GEM is an equipment interface protocol for equipment-to-host data communications in the semiconductor industry. Several xyztec customers use the bi-directional SECS/GEM capability of the Sigma for test results, images, recipes, and other data.



Sigma bond testers are fully GEM300 compliant, ushering in a new era of manufacturing efficiency with seamless communication and automation between bond testers and production equipment, ideal for automated lead frame and wafer testing.

Central database

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Tom Haley