Sigma bond testers are modular by design and come with game-changing automation capabilities for automatic loading, testing and analyzing. The Revolving Measurement Unit (RMU) houses up to 6 sensors that enable continuous testing. The software includes vision and deep learning technology to eliminate human errors.
Integrate the Sigma W8 with an independent wafer (un)loader for hands-free bond testing. The wafer handler automatically loads, aligns and transfers the wafers from the cassette onto the bond tester. The cassette mapper detects empty slots and ensures safe wafer handling.
The system gently secures flat and warped wafers with the soft, flexible tips on the PID controlled wafer lift pins.
The Sigma W8 is upgradeable to the market-leading Sigma W12 bond tester, which can test wafers up to 12 inches (300 mm) fully automatically. The Sigma W12 comes with a 600 mm X stage to test bumps down to 20 µm. The upgrade possibility makes the Sigma W8 a future-proof investment.
| STAGES | SIGMA W8 |
|---|---|
| X-stage (mm) | 370 |
| Y-stage (mm) | 370 |
| Z-stage (mm) | 168 |
| Axis speed (mm/s) | 50 |
| Resolution linear encoders (backlash free drives) (nm) | 30 |
| Digital temperature correction |  |
| ACCURACY | |
| Accuracy (%) | 0.075 |
| ADC resolution (bit) | 24 |
| Sampling frequency (kHz) | 10 |
| Shear height (step back) accuracy ±1 μm | |
| Programmable landing force down to 5 gf | |
| MECHANICAL | |
| Footprint X (mm) | 620 |
| Footprint Y (mm) | 935 |
| Height (mm) | 608 |
| Weight (± kg) | 100 |
Please contact us for more information and options for your factory. Specifications are subject to change without prior notice.
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