Gently secure flat and warped wafers because of the soft, flexible tips on the PID controlled wafer lift pins. Vacuum sensing and switching are intelligently timed with the lift pin position throughout the load, clamp, and unload cycle.
In cases of extreme warpage, an optional wafer pusher ensures precise clamping. The high airflow of vacuum chucks pulls down wafers.
Keep test debris away from the wafer or the wafer chuck with a blower and vacuum cleaner or a roller with sticky foil, for pre- and post-cleaning.
Integration transforms the bond tester into a fully automated system. We offer various types of wafer handlers (Equipment Front End Module), for operator-free bond testing.
Vacuum work holder for panels or wafers up to 300 mm. Easily reach 100% of a 300 mm panel without repositioning your sample on the chuck. The wafer chuck work holder comes with safety interlocks and 360° rotation.
Easily import and export multiple file formats for wafer maps such as KLARF, (S)INF, G85, and others for full traceability. Defects or test positions are shown in an overview and are directly accessible for testing or analysis.
Automatically shear the big bumps and clean the debris to prepare for wafer probing. Fully programmable vision algorithms can check if the removal of big bumps was successful.
The solder that builds up in the cavity of the Cold Bump Pull (CBP) jaw reduces the gripping efficiency. This contactless cavity cleaner melts the solder with a high temperature and high-pressure air jet and then blows it into a fine matrix where it is absorbed.
| STAGES | SIGMA W12 |
|---|---|
| X-stage (mm) | 500 |
| Y-stage (mm) | 370 |
| Z-stage (mm) | 90 |
| Axis speed (mm/s) | 50 |
| Resolution linear encoders (backlash free drives) (nm) | 30 |
| Digital temperature correction |  |
| ACCURACY | |
| Accuracy (%) | 0.075 |
| ADC resolution (bit) | 24 |
| Sampling frequency (kHz) | 10 |
| Shear height (step back) accuracy ±1 μm | |
| Programmable landing force down to 5 gf | |
| MECHANICAL | |
| Footprint X (mm) | 1300 |
| Footprint Y (mm) | 935 |
| Height (mm) | 608 |
| Weight (± kg) | 100 |
Please contact us for more information and options for your factory. Specifications are subject to change without prior notice.
Standard 
Optional
Not available
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Dirk Schade