Can your current bond tester test all your applications fully automated? See how other companies work with most advanced system on the market.
XYZTEC also offers a 300mm (12 inch) wafer testing machine for precision shear testing and Cold Bump Pull (CBP) with or without wafer handler.
We ensure correlation for cross referencing test results between old and new platforms.
28 Apr - Semicon Penang 2017 successful
The Revolving Measurement Unit (RMU) enables continuous operation with up to six different test types on the one machine at forces up to 200kgf. Additionally, you can also choose for dedicated systems. XYZTEC is also unique in its high force products and next generation tweezers.
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Every seminar is focussed around a particular aspect of the science of bond testing.
2017 IEEE 67th Electronic Components and Technology Conference (ECTC)
International Microwave Symposium (IMS 2017)
Semicon Russia 2017