Condor Sigma bond tester
Full automation, 0.075% accuracy, best ergonomics, highest throughput, vision options, lowest cost of ownership, on board 10gf to 200kgf pull and shear sensors available at the touch of a button
XYZTEC also offers a 300mm (12 inch) wafer testing machine for precision shear testing and Cold Bump Pull (CBP) with or without wafer handler.
Reasons why the Condor Sigma is the world's most popular bond tester
Superior speed
Featuring 50 mm/s the axes are very fast. Combined with efficient software, you get the highest UPH.
Automation
The Sigma's 1µm stage accuracy, large test volume and vision technology enable full automation.
Easy to use
The most ergonomic system on the market. New operators learn to use the software within hours.
Accuracy
Technology leader XYZTEC's Condor Sigma gives you unparalleled 0.075% accuracy.
Customization
XYZTEC's consultants are happy to help you with any special bond testing requests you might have.
Correlation
We ensure correlation for cross referencing test results between old and new platforms.
Future proof modular design
Whether you buy a Lite, a Sigma or a W12, all systems come with lifetime free software upgrades.
Revolving Measurement Unit
Multiple load cell cartridge for up to 6 sensors that measure 0.1gf - 200kgf. Single heads up to 500kgf.
Worldwide customer service
As market leader around the world, our support is international. Spare parts are available locally.
News
Bond testing made easy
XYZTEC is the market and technology leader in bond testing worldwide. The Condor Sigma is the most advanced bond tester on the market, providing leading customers with fully automated solutions.
The Revolving Measurement Unit (RMU) enables continuous operation with up to six different test types on the one machine at forces up to 200kgf. Additionally, you can also choose for dedicated systems. XYZTEC is also unique in its high force products and next generation tweezers.
Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Every seminar is focussed around a particular aspect of the science of bond testing.
References
As market leader in bondtesting, XYZTEC has produced lots of success stories since the company was incorporated in 2000.
Consumables webshop
Order a wide range of wire hooks, shear tools, tweezer tips and other items in our webshop.
Test types
- Ball shear / Solder ball shear
- Bending
- Cavity shear
- Cold Bump Pull
- Copper pillar
- Creep test
- Die shear
- Fatigue
- High speed impact
- Lead integrity / Micro torsion
- Lid pull
- Lid torque
- Loop height test
- Overhanging die
- Passivation layer gold ball shear
- Probe test
- Ribbon peel
- Ribbon pull
- Scratch / coating
- SMD shear
- SMD gull wing leads
- Spring rigidity
- Stud pull
- Total Ball Shear / Zone shear
- Tweezer pull
- Vector pull
- Wedge and ribbon shear
- Wire pull
Events
| 04..07 | Mar | IMAPS Device Packaging USA 2019 |
| 14..16 | Mar | Semicon China 2019 |
| 27 | Mar | IMAPS Frühjahrsseminar 2019 |