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Wafer-testing

Ball on ring

Ball on ring The ball-on-ring (BoR) test method is a crucial technique widely employed for characterizing the biaxial strength and axially symmetric bending of brittle materials such as..

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Wafer-testing

Ball on ring

Ball on ring The ball-on-ring (BoR) test method is a crucial technique widely employed for characterizing the biaxial strength and axially symmetric bending of brittle materials such as..
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