Ultra-thin die with reduced layer thickness enable the high mechanical flexibility required for many new applications. This however increases the demand for manufacturing and testing. The standard shear test can not be used for ultra-thin die, because of their thickness. Analysis of the mechanical resistance to bending before the chip breaks becomes more important.
This analysis can be performed with the xyztec Sigma and the corresponding uni-axial bending test. With this test geometric tolerances and deflection of a chip are taken into account and further customization is possible with the software developed by xyztec. Our company presented this uni-axial bending test for the first time at the Semicon West 2012 in San Francisco.