Wire detect functionality popular at Productronica

12 November 2015

XYZTEC team at Productronica 2015
XYZTEC team at Productronica 2015

This week, XYZTEC is exhibiting at Productronica 2015 in München, Germany. Many visitors stop by to see with their own eyes the new wire detect functionality, which is the next step forward in wire pull. The bondtester optically detects the wire and corrects for wire sweep before going on to pull the wire automatically. This ensures more repeatable positioning, consistency in your bond test results, fast test speed and high accuracy.

Visit us at Productronica 2015 A2 Booth 119
Visit us at Productronica 2015 A2 Booth 119

Friday November 13th is the last day of the Productronica 2015 in München, Germany. We invite you to come to our booth at A2 with number 119, have a look at the Condor Sigma, the Condor Sigma W12 that are there or to chat about the amazing new possibilities in the area of bond testing.

Click here to find out more about XYZTEC's Condor Sigma bond testers. The Condor Sigma W12 is specifically designed for precision shear testing and Cold Bump Pull (CBP) on wafer or at wafer level.


Newsletters

Aug 2018 Is Fully Automatic Bond Testing Possible?
Jul 2017 Advances in Thin, 3D and MEMS Die Bond Strength Testing
May 2017 Shear testing copper pillar
Mar 2017 Fracture strength of thin wafers and die
Feb 2017 Centralized database for enhanced security and SPC options
Jan 2017 Full Automation with Improved Pattern Recognition, Fiducial Marks Analysis, Wire Detect and Failure Mode Analysis
Dec 2016 Coating and film testing
Nov 2016 Latest software release enables automatic grading
Oct 2016 Vision enhanced materials testing
Sep 2016 XYZTEC makes lid pull easy
Aug 2016 Condor Sigma W12 with large heater stage
Jul 2016 How to: Wire Pull

 
Click to subscribe.

Other news

20 Sep Successful ESTC Conference in Dresden, Germany
11 Jul LEGO® for Nepal sponsored by XYZTEC
05 Jun Visit us at SMT Hybrid Packaging Nuremberg
20 Apr Smart LED and Solar panels for XYZTEC head office
18 Apr XYZTEC workshop at IMAPS UK
16 Mar ODEOM shows Condor Sigma in Istanbul
15 Mar Semicon China under way
31 Jan Condor Sigma W12 at Semicon Korea
04 Dec Condor Sigma stars in Audi Tech Day video
10 Nov Raysun to represent XYZTEC in China
23 Oct Award for First Technology China
19 Jul XYZTEC granted subsidy for further accuracy improvements
23 Jun Presentation at CSPT 2017 by Bob Sykes
06 Jun Condor Sigma in São Paulo, Brazil
16 May Fully automatic lead frame tester introduced at SMT Hybrid Packaging
28 Apr Semicon Penang 2017 successful
28 Apr Pizza and Go cart racing at K1 Speed in Northern CA
14 Mar Visit us at Semicon China
16 Feb Job opening for Junior Mechanical Design Engineer [closed]
29 Nov Successful seminar in Russia with Sovtest
31 Oct Market leading Condor Sigma bond tester at TPCA Taiwan
08 Sep Automation features draw attention at Semicon Taiwan 2016
28 Jun HTMG represents XYZTEC in South America
14 Jun Bob Sykes speaks at China Semiconductor Packaging Test Symposium (CSPT) [UPDATED]
14 Jun Purchase wire hooks, shear tools, tweezer tips by PayPal


View all news

Subscribe to our RSS-feed to be notified of the latest news automatically. You can also find us on Facebook, LinkedIn, Twitter, Weibo 微博, Google+, YouKu 优酷 and YouTube.


XYZTEC Newsletter

Subscribe

Your name:

Your email:


© 1999-2016 XYZTEC BV Disclaimer, Privacy, Cookies
Home
News
Condor Sigma
Condor 150HF
Test types
Markets & solutions
Sales & support
Downloads
Events
Shop

XYZTEC Netherlands

J.F. Kennedylaan 14-B
5981 XC Panningen
Netherlands (map / route)

Tel: +31-77-3060920
Fax: +31-77-3060919

Find your local representative

XYZTEC Germany

Schäferei 18
06237 Leuna
OT Günthersdorf
Germany
(map / route)
Tel: +49-34638-666690
Fax: +49-34638-666695
Cell: +49-172-3272991
Email: Dirk Schade

Find other office locations

Technology leader in bond testing worldwide