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Presentation at CSPT 2017 by Bob Sykes

Presentation at CSPT 2017 by Bob Sykes

Presentation by Bob Sykes at CSPT 2017

For the second year in a row, xyztec CTO Bob Sykes was invited to speak at China Semiconductor Packaging Test Symposium (CSPT).

Recent and Future Advances in Bond Testing

Hundreds of visitors attended the presentation on “Recent and Future Advances in Bond Testing”. The audience among which many leading corporations that employ bond testing was very interested in the subjects presented.

CSPT-2017-presentation-Bob-Sykes-hall-web

CSPT-2017-presentation-failure-mode-analysis-web

 

Presentation by Bob Sykes

Among the presented topics were the current state of technology in vision analysis and illumination, coating and film testing and xyztec’s brand new lead frame handler.

 

China Semiconductor Packaging Test Symposium (CSPT)

CSPT is a professional conference that focuses on Semiconductor Packaging & Testing. It was held for the 15th time, this time in Jiangyin, China. Directed by Department of Electronics Information, the Ministry of Industry and Information Technology of the People’s Republic of China and Chinese Institute of Electronics is organized by China Semiconductor Industry Association.

CSPT-2017-booth-XYZTEC-web

 

Bond testing seminar

Click here to apply for a bond testing seminar.

 

Presentation by Bob Sykes at CSPT 2017

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