Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Every seminar is focussed around a particular aspect of the science of bond testing.
The XYZTEC expert holds an informative presentation and invites the attendees to participate by asking questions and sharing their thoughts and experience on the subject. Additionally, every seminar provides the opportunity for your quality control engineers to discuss any bond testing challenges that your company is facing with the XYZTEC experts.
Currently, we have composed 7 different bond testing seminar modules, each containing multiple sections:
The seminars are held in various locations all over the world. The series presents networking opportunities, attracting a broad spectrum of attendees. However, XYZTEC is open to organize dedicated sessions for interested customers, depending on the demand and schedule.
IMAPS Device Packaging 2018
OPTICAL Fiber Conference
Semicon China 2018
Nepcon China 2018
Semicon Southeast Asia 2018
2018 IEEE 68th ECTC Conference
SMT Hybrid Packaging 2018
JPCA Japan Electronics Packaging 2018
Semicon West Show 2018
Nepcon South China 2018
Semicon Taiwan 2018
IMAPS 51th Anniversary Symposium