Aiming to improve understanding of bond testing in the industry, XYZTEC organizes seminars to present and disseminate knowledge in a straightforward format. Every seminar is focussed around a particular aspect of the science of bond testing.
The XYZTEC expert holds an informative presentation and invites the attendees to participate by asking questions and sharing their thoughts and experience on the subject. Additionally, every seminar provides the opportunity for your quality control engineers to discuss any bond testing challenges that your company is facing with the XYZTEC experts.
Currently, we have composed 7 different bond testing seminar modules, each containing multiple sections:
The seminars are held in various locations all over the world. The series presents networking opportunities, attracting a broad spectrum of attendees. However, XYZTEC is open to organize dedicated sessions for interested customers, depending on the demand and schedule.
IMAPS Device Packaging USA 2019
Semicon China 2019
IMAPS Frühjahrsseminar 2019
CAM-Workshop and Technology Exhibition
Expo Electronica Russia 2019
SMT Hybrid Packaging Germany 2019
Space Tech Conference USA 2019
ECTC Las Vegas 2019 (IEEE 69th)
IMS Boston 2019
IMAPS SIP USA 2019
CIOE China 2019
EMPC Italy 2019
Semicon Taiwan 2019
IMAPS USA 2019
Productronica Germany 2019