Pull testing bumped wafers
Whilst the construction of wafer bumps take many forms testing their quality by bond testing requires either pull or shear testing. Shear testing has the advantage of being easier than […]
Tag: 4 tweezer 1 RMU
Whilst the construction of wafer bumps take many forms testing their quality by bond testing requires either pull or shear testing. Shear testing has the advantage of being easier than […]
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Xyztec develops world-class bond testing technologies and works together with global partners to provide local support worldwide.
J.F. Kennedylaan 14b
5981 XC
Panningen
The Netherlands
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Tom Haley
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