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xyztec bv

ECTC 2023 1

Xyztec’s successful participation at ECTC 2023 in Orlando

Xyztec showcased its cutting-edge solutions and expertise at the prestigious Electronic Components and Technology Conference (ECTC) held last week in Orlando. Our presence at the event was successful..
Senselektro-2022

New distributor in Hungary

As the technology leader, we strive to have local representatives all around the world to provide local support worldwide. That is why we have added a new distributor..
45 degree self aligning tool

Advances thin, 3D and MEMS die bond testing

As market leader in bond testing, xyztec is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond..
MIT-Zuid

Xyztec granted subsidy for further accuracy improvements

Last week, xyztec was granted a €25k subsidy by the Dutch Ministry of Economic Affairs and the province of Limburg. The MIT Zuid grant is for a feasibility..

Bob Sykes speaks at China Semiconductor Packaging Test Symposium (CSPT)

Tomorrow at around 13:30 local time, xyztec CTO Bob Sykes shall hold a keynote speech on "Recent and Future Advances in Bond Testing" at China Semiconductor Packaging Test..

Search results in xyztec

ECTC 2023 1

Xyztec’s successful participation at ECTC 2023 in Orlando

Xyztec showcased its cutting-edge solutions and expertise at the prestigious Electronic Components and Technology Conference (ECTC) held last week in Orlando. Our presence at the event was successful..
Senselektro-2022

New distributor in Hungary

As the technology leader, we strive to have local representatives all around the world to provide local support worldwide. That is why we have added a new distributor..
45 degree self aligning tool

Advances thin, 3D and MEMS die bond testing

As market leader in bond testing, xyztec is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond..
MIT-Zuid

Xyztec granted subsidy for further accuracy improvements

Last week, xyztec was granted a €25k subsidy by the Dutch Ministry of Economic Affairs and the province of Limburg. The MIT Zuid grant is for a feasibility..

Bob Sykes speaks at China Semiconductor Packaging Test Symposium (CSPT)

Tomorrow at around 13:30 local time, xyztec CTO Bob Sykes shall hold a keynote speech on "Recent and Future Advances in Bond Testing" at China Semiconductor Packaging Test..
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