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xyztec bv

Cold Bump Pull (CBP)

Pull testing bumped wafers

Whilst the construction of wafer bumps take many forms testing their quality by bond testing requires either pull or shear testing. Shear testing has the advantage of being..

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Cold Bump Pull (CBP)

Pull testing bumped wafers

Whilst the construction of wafer bumps take many forms testing their quality by bond testing requires either pull or shear testing. Shear testing has the advantage of being..
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