Visit us at SMTconnect 2022
After COVID-19, we are finally exhibiting again, and this time with our brand new booth design! So if you have not yet managed to visit this year’s SMTconnect in the […]
Sigma High Force live in action
Come and visit us this week at the SMTconnect from May 7th until May 9th at the Nuremberg Messe in Germany. At our extended booth in Hall 4A/147 we present the […]
Successful ESTC Conference in Dresden, Germany
The ESTC Conference 2018, an event in the field of microelectronics packaging and system integration, this week was very successful. Xyztec, the technology leader in bond testing, was present to […]
Fully automatic lead frame tester introduced at SMT Hybrid Packaging
This week, xyztec is exhibiting at SMT Hybrid Packaging in Nuremberg, Germany. The show is a special occasion, as xyztec is exhibiting a brand new fully automatic lead frame tester. […]
Automatic wire detection draws attention at SMT 2015
Xyztec is exhibiting this week at SMT Hybrid Packaging 2015 in Nürnberg, Germany. The xyztec stand has been busy all week, with the automatic wire detection functionality and the Sigma […]
Xyztec shows full automation on the Sigma at the SMT 2014 in Nürnberg
Our Global Sales Manager Dirk Schade talks about the bond tester Sigma and the way xyztec demonstrates full automation at SMT/Hybrid/Packaging 2014 in Nürnberg, Germany:
Xyztec Sales Director Dirk Schade joins the IMAPS board
For the past 12 years xyztec in the Netherlands has been an active exhibitor and sponsor for the IMAPS Germany. Internationally, xyztec is also a regular participant to the IMAPS […]
